Prediction of Stress Induced Voiding Reliability in Cu Damascene Interconnect by Computer Aided Vacancy Migration Analysis

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Bibliographic Details
Published in:Japanese Journal of Applied Physics 2011-05, Vol.50 (5S1), p.5
Main Authors: Shigeyama, Haruhisa, Nemoto, Takenao, Jr, A. Toshimitsu Yokobori
Format: Article
Language:eng ; jpn
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ISSN:0021-4922
1347-4065
DOI:10.7567/JJAP.50.05EA05