Effects of Postetching Treatment on Molecular-Pore-Stacking/Cu Interconnects for 28 nm Node and Beyond

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Bibliographic Details
Published in:Japanese Journal of Applied Physics 2011-05, Vol.50 (5S1), p.5
Main Authors: Oshida, Daisuke, Kume, Ippei, Katsuyama, Hirokazu, Taiji, Toshiji, Maruyama, Takuya, Ueki, Makoto, Inoue, Naoya, Iguchi, Manabu, Fujii, Kunihiro, Oda, Noriaki, Sakurai, Michio
Format: Article
Language:eng ; jpn
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ISSN:0021-4922
1347-4065
DOI:10.7567/JJAP.50.05EB04