Through-Silicon-Via Design with Clustering Structure and Adaptive Through-Silicon-Via Control for Three-Dimentional Solid-State-Drive Boost Converter System

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Bibliographic Details
Published in:Japanese Journal of Applied Physics 2012-02, Vol.51 (2S), p.2
Main Authors: Johguchi, Koh, Hatanaka, Teruyoshi, Takeuchi, Ken
Format: Article
Language:English
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ISSN:0021-4922
1347-4065
DOI:10.7567/JJAP.51.02BE02