A Thermally-Reliable, Low-Resistivity Cu(Ir) and Cu(IrN) Alloy Films for Barrierless Cu Metallization

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Bibliographic Details
Published in:Japanese Journal of Applied Physics 2012-05, Vol.51 (5S), p.5
Main Author: Lin, Chon-Hsin
Format: Article
Language:eng ; jpn
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ISSN:0021-4922
1347-4065
DOI:10.7567/JJAP.51.05EA05