Erratum: "Atomic Layer Deposited Co(W) Film as a Single-Layered Barrier/Liner for Next-Generation Cu-Interconnects"

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Bibliographic Details
Published in:Japanese Journal of Applied Physics 2014-07, Vol.53 (8), p.89202
Main Authors: Shimizu, Hideharu, Sakoda, Kaoru, Momose, Takeshi, Shimogaki, Yukihiro
Format: Article
Language:English
Online Access:Get full text
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ISSN:0021-4922
1347-4065
DOI:10.7567/JJAP.53.089202