Room-temperature hard coating of ultrananocrystalline diamond/nonhydrogenated amorphous carbon composite films on tungsten carbide by coaxial arc plasma deposition

Ultrananocrystalline diamond (UNCD)/nonhydrogenated amorphous carbon (a-C) composite films were deposited on unheated WC containing Co by coaxial arc plasma deposition. The hardness of the film is 51.3 GPa, which is comparable with the highest values of hard a-C films deposited on nonbiased substrat...

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Bibliographic Details
Published in:Japanese Journal of Applied Physics 2016-03, Vol.55 (3), p.30302
Main Authors: Naragino, Hiroshi, Egiza, Mohamed, Tominaga, Aki, Murasawa, Koki, Gonda, Hidenobu, Sakurai, Masatoshi, Yoshitake, Tsuyoshi
Format: Article
Language:English
Subjects:
Arc deposition
Carbon
Deposition
Diamonds
Grain boundaries
Plasma deposition
Residual stress
Tungsten carbide
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Summary:Ultrananocrystalline diamond (UNCD)/nonhydrogenated amorphous carbon (a-C) composite films were deposited on unheated WC containing Co by coaxial arc plasma deposition. The hardness of the film is 51.3 GPa, which is comparable with the highest values of hard a-C films deposited on nonbiased substrates. The deposited film is approximately 3 µm thick, which is one order larger than that of hard a-C films. The internal compressive stress is 4.5 GPa, which is evidently smaller than that of comparably hard a-C films. The existence of a large number of grain boundaries in the UNCD/a-C film might play a role in the release of the internal stress.
ISSN:0021-4922
1347-4065
DOI:10.7567/JJAP.55.030302