Effect of Morphological Structure, Temperature and Solvent on the Association Behavior of Some Copper Salts- Conductometric Study

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Bibliographic Details
Published in:International research journal of pure and applied chemistry 2018-10, Vol.17 (1), p.1-10
Main Authors: El-Dossoki, Farid I., Elgamal, Alaa H., Elgamal, Menna Allah H., Ibrahim, Salma A.
Format: Article
Language:English
Online Access:Get full text
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ISSN:2231-3443
2231-3443
DOI:10.9734/IRJPAC/2018/44420