Development of a multimaterial additive manufacturing process for electronic devices

In order to increase the versatility of additive manufacturing multimaterial processes, a hybrid system has been developed, which is capable of combining 3D printing technology by DLP (Digital Light Processing) with a two-dimensional Drop-on-Demand Inkjet printing system. Through DLP technology base...

Full description

Saved in:
Bibliographic Details
Main Authors: Muguruza Blanco, Asier, Bonada Bo, Jordi, Gómez Fernández, Agustín, Minguella Canela, Joaquim, Fernándes, Joana, Ramos, Francisco, Xuriguera Martin, Elena, Varea Espelt, Aida, Cirera Hernandez, Albert
Format: Text Resource
Language:English
Subjects:
Additive Manufacturing
Aplicacions industrials
Enginyeria mecànica
Impressió 3D
Multimaterial
Printing Electronics
Technology applications
Tecnologia
Three-dimensional printing
Àrees temàtiques de la UPC
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:In order to increase the versatility of additive manufacturing multimaterial processes, a hybrid system has been developed, which is capable of combining 3D printing technology by DLP (Digital Light Processing) with a two-dimensional Drop-on-Demand Inkjet printing system. Through DLP technology based on digital micromirror devices (DMDs) it is possible to build up 3D geometries layer-by-layer using polymerization of photosensitive resins. Concurrently, while the construction process is performed, the InkJet printing system is used to deposit tiny drops of conductive inks on the substrate generated, which will thus constitute an electric circuit embedded within the three dimensional structure. On the other hand, photosensitive resins have been filled with Low Temperature Co-firing Ceramic (LTCC) particles, in order to modify the basis properties of the part by using sinterizable slurries. Finally the challenges in the sintering process for achieving functional parts are discussed and a few prototypes have been built in order to validate this technology. Peer Reviewed
ISSN:2351-9789
2351-9789
DOI:10.1016/j.promfg.2017.09.180