Structural Analysis of Power Devices and Assemblies by Thermal Transient Measurements

Power modules composed of semiconductor dice, thermal interface layers, and cooling mounts can be characterized by thermal transient testing at their actual position (in situ). This paper demonstrates that transient testing enables tracking of changes in material quality and structural details on th...

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Bibliographic Details
Published in:Energies (Basel) 2019, Vol.12 (14), p.2696
Main Authors: Farkas, Gabor, Sarkany, Zoltan, Rencz, Marta
Format: Article
Language:English
Subjects:
Calibration
Capacitance
Cooling
Cooling curves
Design of experiments
Electric power distribution
Exponential functions
Heat
Heat transfer
Heat transfer coefficients
Heat transmission
Heating
in-situ characterization
Interfaces
Methods
non-destructive testing
Sequences
Structural analysis
Structural members
Structure-function relationships
Temperature
Thermal resistance
thermal testability
thermal transient testing
Thermal transients
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Description
Summary:Power modules composed of semiconductor dice, thermal interface layers, and cooling mounts can be characterized by thermal transient testing at their actual position (in situ). This paper demonstrates that transient testing enables tracking of changes in material quality and structural details on the raw heating or cooling curves. Higher precision can be achieved with the structure function technique where absolute and partial thermal resistance and capacitance values can be used for unambiguous identification of structural elements in a heat conducting path. Measurement techniques are presented to characterize the self-heating of a die and heat transfer between dice. Change of the thermal interface material layers in assembly during test sequences is also highlighted by the structure function concept. The power distribution between dice and wiring is analyzed by the newly introduced “accordion” principle.
ISSN:1996-1073
1996-1073
DOI:10.3390/en12142696