Temperature modeling and emulation of an ASIC temperature monitor system for Tightly-Coupled Processor Arrays (TCPAs)

This contribution provides an approach for emulating the behaviour of an ASIC temperature monitoring system (TMon) during run-time for a tightly-coupled processor array (TCPA) of a heterogeneous invasive multi-tile architecture to be used for FPGA prototyping. It is based on a thermal RC modeling ap...

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Bibliographic Details
Published in:Advances in radio science 2014-11, Vol.12 (15), p.103-109
Main Authors: Glocker, E, Boppu, S, Chen, Q, Schlichtmann, U, Teich, J, Schmitt-Landsiedel, D
Format: Article
Language:English
Subjects:
Analysis
Application specific integrated circuits
Architecture (computers)
Field programmable gate arrays
Glass transition temperature
Monitoring
Monitors
Processor arrays
Prototyping
Run time (computers)
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Description
Summary:This contribution provides an approach for emulating the behaviour of an ASIC temperature monitoring system (TMon) during run-time for a tightly-coupled processor array (TCPA) of a heterogeneous invasive multi-tile architecture to be used for FPGA prototyping. It is based on a thermal RC modeling approach. Also different usage scenarios of TCPA are analyzed and compared.
ISSN:1684-9973
1684-9965
1684-9973
DOI:10.5194/ars-12-103-2014