Effect of Mo on interdifussion behaviors and interfacial characteristics in multicomponent diffusion couple of FeCoCrNi high entropy alloys and diamond

[Display omitted] •The diffusion couples of diamond/HEA and diamond/Mo/HEA composite structure were designed and fabricated.•The σ and μ intermetallic phase were formed in the two kinds of composite structures.•The graphitization of diamond happened in diamond/HEA composite structure.•The Mo-rich μ...

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Bibliographic Details
Published in:Materials & design 2022-03, Vol.215, p.110522, Article 110522
Main Authors: Peng, Yingbo, Wang, Haijiang, Li, Qin, Wang, Li, Zhang, Wei, Zhang, Lijun, Guo, Song, Liu, Yong, Liu, Shuyu, Ma, Qingyuan
Format: Article
Language:English
Subjects:
Diamond
Diffusion barrier
High entropy alloy
Interface
Refractory metal
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Summary:[Display omitted] •The diffusion couples of diamond/HEA and diamond/Mo/HEA composite structure were designed and fabricated.•The σ and μ intermetallic phase were formed in the two kinds of composite structures.•The graphitization of diamond happened in diamond/HEA composite structure.•The Mo-rich μ phase in diamond/Mo/HEA composite structure exhibited obvious diffusion barrier effect. A multi-component diffusion couple of diamond/Mo/FeCoCrNi HEA composite structure was designed and fabricated, and the refractory metal Mo was introduced to construct a diffusion barrier between diamond and HEA. The interfacial diffusion and microstructural evolution of the diffusion couple were studied. The results indicated that, after diffusion, the Diamond/HEA composite structure formed equiaxed Cr-rich σ phase and polycrystal graphite at interface. In contrast, the Diamond/Mo/HEA composite structure formed Mo-rich μ phase at the interface. The graphitization in Diamond/Mo/HEA was significantly reduced compared to the Diamond/HEA composite structure. Due to the low solubility of Fe, Co and Ni in μ phase, and the low interdifussion coefficient of Co, Ni in Mo, the Mo layer was manifested as an effective diffusion barrier against the diffusion of HEA into the diamond. Moreover, the metallurgical bonding with high interfacial bonding strength was formed at the interface of the composite structures due to the semi-coherent interface and incoherent interface in Diamond/HEA and Diamond/Mo/HEA, respectively.
ISSN:0264-1275
1873-4197
DOI:10.1016/j.matdes.2022.110522