Microstructure and Thermal Conductivity of Sintered Reaction-Bonded Silicon Nitride: The Particle Size Effects of MgO Additive

The particle size effect of MgO as a sintering additive on the thermal conductivity of sintered reaction-bonded silicon nitride (SRBSN) was investigated. It was revealed that the size of MgO is critical for thermal conductivity with regard to the microstructural evolution process. That is, the abnor...

Full description

Saved in:
Bibliographic Details
Published in:Advances in materials science and engineering 2018-01, Vol.2018 (2018), p.1-5
Main Authors: Park, Young-Jo, Kwon, Se-Hun, Kim, Ha-Neul, Ko, Jae-Woong, Li, Yinsheng, Go, Shin-Il, Kim, Hai-Doo
Format: Article
Language:English
Subjects:
Ceramics
Grain growth
Heat transfer
Liquid phases
Magnesium oxide
Materials science
Microstructure
Particle size
Phase distribution
Scientific imaging
Silicon nitride
Sintering
Size effects
Thermal conductivity
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:The particle size effect of MgO as a sintering additive on the thermal conductivity of sintered reaction-bonded silicon nitride (SRBSN) was investigated. It was revealed that the size of MgO is critical for thermal conductivity with regard to the microstructural evolution process. That is, the abnormal grain growth promoted by an inhomogeneous liquid-phase distribution led to higher thermal conductivity when coarser MgO was added, whereas a relatively homogeneous liquid-phase distribution induced moderate grain growth and lower thermal conductivity when finer MgO was added.
ISSN:1687-8434
1687-8442
DOI:10.1155/2018/4263497