Design of a Novel SiP Integrated RF Front-End Module Based on SOI Switch and SAW Filter

This paper proposes a novel System-in-Package (SiP) integrated architecture that incorporates Silicon-On-Insulator (SOI) switches and Surface Acoustic Wave (SAW) filters within the chip, aiming to fulfill the demands for miniaturization and multi-functionality for application in emerging wireless te...

Full description

Saved in:
Bibliographic Details
Published in:Sensors (Basel, Switzerland) Switzerland), 2024-10, Vol.24 (21), p.6994
Main Authors: Wei, Xuanhe, Miao, Youming, Jin, Xiao, Loh, Tian Hong, Liu, Gui
Format: Article
Language:English
Subjects:
Acoustics
Code Division Multiple Access
Communications equipment
Data transmission
Design
diversity acceptance
Electric filters
Flexibility
Integrated circuits
Packaging
Processing speed
Radio frequency
RF front-end module
Semiconductors
SiP integration
Switches
User experience
Wireless communications
Citations: Items that this one cites
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:This paper proposes a novel System-in-Package (SiP) integrated architecture that incorporates Silicon-On-Insulator (SOI) switches and Surface Acoustic Wave (SAW) filters within the chip, aiming to fulfill the demands for miniaturization and multi-functionality for application in emerging wireless technologies. The proposed architecture not only reduces the integration complexity but also considers the architectural design of the integrated module, impedance matching techniques, and signal integrity for carrier aggregation (CA) technology realization. The feasibility of employing SOI switches and SAW filters based on SiP design has been validated through the trial production of a Sub-3GHz radio frequency (RF) front-end diversity receiver module. The resulting RF front-end module demonstrates exceptionally high packaging density and enhanced communication reliability, rendering it suitable for diverse applications in miniaturized RF systems.
ISSN:1424-8220
1424-8220
DOI:10.3390/s24216994