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Design of a Novel SiP Integrated RF Front-End Module Based on SOI Switch and SAW Filter
This paper proposes a novel System-in-Package (SiP) integrated architecture that incorporates Silicon-On-Insulator (SOI) switches and Surface Acoustic Wave (SAW) filters within the chip, aiming to fulfill the demands for miniaturization and multi-functionality for application in emerging wireless te...
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Published in: | Sensors (Basel, Switzerland) Switzerland), 2024-10, Vol.24 (21), p.6994 |
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creator | Wei, Xuanhe Miao, Youming Jin, Xiao Loh, Tian Hong Liu, Gui |
description | This paper proposes a novel System-in-Package (SiP) integrated architecture that incorporates Silicon-On-Insulator (SOI) switches and Surface Acoustic Wave (SAW) filters within the chip, aiming to fulfill the demands for miniaturization and multi-functionality for application in emerging wireless technologies. The proposed architecture not only reduces the integration complexity but also considers the architectural design of the integrated module, impedance matching techniques, and signal integrity for carrier aggregation (CA) technology realization. The feasibility of employing SOI switches and SAW filters based on SiP design has been validated through the trial production of a Sub-3GHz radio frequency (RF) front-end diversity receiver module. The resulting RF front-end module demonstrates exceptionally high packaging density and enhanced communication reliability, rendering it suitable for diverse applications in miniaturized RF systems. |
doi_str_mv | 10.3390/s24216994 |
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fullrecord | <record><control><sourceid>gale_doaj_</sourceid><recordid>TN_cdi_doaj_primary_oai_doaj_org_article_19a1019a213c4efeb6c0fe7ec7c09c84</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><galeid>A815421825</galeid><doaj_id>oai_doaj_org_article_19a1019a213c4efeb6c0fe7ec7c09c84</doaj_id><sourcerecordid>A815421825</sourcerecordid><originalsourceid>FETCH-LOGICAL-c399t-2cdf31ca195d0d6f8047b376808aa062e18345f31e00ee9768f9061566398add3</originalsourceid><addsrcrecordid>eNpdkl1PFDEUhidGIwhe-AdME2_wYrBfM9NemRVY3QSFuBoum257OnQz22I7g_HfW1jcgGnSNud9zttzmlNVbwg-ZkziD5lySlop-bNqn3DKa0Epfv7ovle9ynmNMWWMiZfVHpMN6YTE-9XVKWTfBxQd0uhbvIUBLf0lWoQR-qRHsOj7HM1TDGN9Fiz6Gu00APqkc1FiQMuLBVr-9qO5RrrIy9kVmvthhHRYvXB6yPD64Tyofs7Pfpx8qc8vPi9OZue1YVKONTXWMWI0kY3FtnUC827FulZgoTVuKRDBeFMQwBhAFsFJ3JKmbZkU2lp2UC22vjbqtbpJfqPTHxW1V_eBmHql0-jNAIpITXDZKGGGg4NVa7CDDkxnsDSCF6-PW6-babUBayCMSQ9PTJ8qwV-rPt4qQhouGMPF4ejBIcVfE-RRbXw2MAw6QJyyYoSKjmNxj777D13HKYXyV3dUSztCOlao4y3V69KBDy6Wh01ZFjbexADOl_hMlAIoEbQpCe-3CSbFnBO4XfkEq7thUbthKezbx_3uyH_Twf4CJ0C1bg</addsrcrecordid><sourcetype>Open Website</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>3126271173</pqid></control><display><type>article</type><title>Design of a Novel SiP Integrated RF Front-End Module Based on SOI Switch and SAW Filter</title><source>Open Access: PubMed Central</source><source>Publicly Available Content Database (Proquest) (PQ_SDU_P3)</source><creator>Wei, Xuanhe ; Miao, Youming ; Jin, Xiao ; Loh, Tian Hong ; Liu, Gui</creator><creatorcontrib>Wei, Xuanhe ; Miao, Youming ; Jin, Xiao ; Loh, Tian Hong ; Liu, Gui</creatorcontrib><description>This paper proposes a novel System-in-Package (SiP) integrated architecture that incorporates Silicon-On-Insulator (SOI) switches and Surface Acoustic Wave (SAW) filters within the chip, aiming to fulfill the demands for miniaturization and multi-functionality for application in emerging wireless technologies. The proposed architecture not only reduces the integration complexity but also considers the architectural design of the integrated module, impedance matching techniques, and signal integrity for carrier aggregation (CA) technology realization. The feasibility of employing SOI switches and SAW filters based on SiP design has been validated through the trial production of a Sub-3GHz radio frequency (RF) front-end diversity receiver module. The resulting RF front-end module demonstrates exceptionally high packaging density and enhanced communication reliability, rendering it suitable for diverse applications in miniaturized RF systems.</description><identifier>ISSN: 1424-8220</identifier><identifier>EISSN: 1424-8220</identifier><identifier>DOI: 10.3390/s24216994</identifier><identifier>PMID: 39517890</identifier><language>eng</language><publisher>Switzerland: MDPI AG</publisher><subject>Acoustics ; Code Division Multiple Access ; Communications equipment ; Data transmission ; Design ; diversity acceptance ; Electric filters ; Flexibility ; Integrated circuits ; Packaging ; Processing speed ; Radio frequency ; RF front-end module ; Semiconductors ; SiP integration ; Switches ; User experience ; Wireless communications</subject><ispartof>Sensors (Basel, Switzerland), 2024-10, Vol.24 (21), p.6994</ispartof><rights>COPYRIGHT 2024 MDPI AG</rights><rights>2024 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.</rights><rights>2024 by the authors. 2024</rights><lds50>peer_reviewed</lds50><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed><cites>FETCH-LOGICAL-c399t-2cdf31ca195d0d6f8047b376808aa062e18345f31e00ee9768f9061566398add3</cites><orcidid>0000-0002-3486-2659 ; 0000-0001-5144-5614</orcidid></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://www.proquest.com/docview/3126271173/fulltextPDF?pq-origsite=primo$$EPDF$$P50$$Gproquest$$Hfree_for_read</linktopdf><linktohtml>$$Uhttps://www.proquest.com/docview/3126271173?pq-origsite=primo$$EHTML$$P50$$Gproquest$$Hfree_for_read</linktohtml><link.rule.ids>230,314,727,780,784,885,25753,27924,27925,37012,37013,44590,53791,53793,74998</link.rule.ids><backlink>$$Uhttps://www.ncbi.nlm.nih.gov/pubmed/39517890$$D View this record in MEDLINE/PubMed$$Hfree_for_read</backlink></links><search><creatorcontrib>Wei, Xuanhe</creatorcontrib><creatorcontrib>Miao, Youming</creatorcontrib><creatorcontrib>Jin, Xiao</creatorcontrib><creatorcontrib>Loh, Tian Hong</creatorcontrib><creatorcontrib>Liu, Gui</creatorcontrib><title>Design of a Novel SiP Integrated RF Front-End Module Based on SOI Switch and SAW Filter</title><title>Sensors (Basel, Switzerland)</title><addtitle>Sensors (Basel)</addtitle><description>This paper proposes a novel System-in-Package (SiP) integrated architecture that incorporates Silicon-On-Insulator (SOI) switches and Surface Acoustic Wave (SAW) filters within the chip, aiming to fulfill the demands for miniaturization and multi-functionality for application in emerging wireless technologies. The proposed architecture not only reduces the integration complexity but also considers the architectural design of the integrated module, impedance matching techniques, and signal integrity for carrier aggregation (CA) technology realization. The feasibility of employing SOI switches and SAW filters based on SiP design has been validated through the trial production of a Sub-3GHz radio frequency (RF) front-end diversity receiver module. The resulting RF front-end module demonstrates exceptionally high packaging density and enhanced communication reliability, rendering it suitable for diverse applications in miniaturized RF systems.</description><subject>Acoustics</subject><subject>Code Division Multiple Access</subject><subject>Communications equipment</subject><subject>Data transmission</subject><subject>Design</subject><subject>diversity acceptance</subject><subject>Electric filters</subject><subject>Flexibility</subject><subject>Integrated circuits</subject><subject>Packaging</subject><subject>Processing speed</subject><subject>Radio frequency</subject><subject>RF front-end module</subject><subject>Semiconductors</subject><subject>SiP integration</subject><subject>Switches</subject><subject>User experience</subject><subject>Wireless communications</subject><issn>1424-8220</issn><issn>1424-8220</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2024</creationdate><recordtype>article</recordtype><sourceid>PIMPY</sourceid><sourceid>DOA</sourceid><recordid>eNpdkl1PFDEUhidGIwhe-AdME2_wYrBfM9NemRVY3QSFuBoum257OnQz22I7g_HfW1jcgGnSNud9zttzmlNVbwg-ZkziD5lySlop-bNqn3DKa0Epfv7ovle9ynmNMWWMiZfVHpMN6YTE-9XVKWTfBxQd0uhbvIUBLf0lWoQR-qRHsOj7HM1TDGN9Fiz6Gu00APqkc1FiQMuLBVr-9qO5RrrIy9kVmvthhHRYvXB6yPD64Tyofs7Pfpx8qc8vPi9OZue1YVKONTXWMWI0kY3FtnUC827FulZgoTVuKRDBeFMQwBhAFsFJ3JKmbZkU2lp2UC22vjbqtbpJfqPTHxW1V_eBmHql0-jNAIpITXDZKGGGg4NVa7CDDkxnsDSCF6-PW6-babUBayCMSQ9PTJ8qwV-rPt4qQhouGMPF4ejBIcVfE-RRbXw2MAw6QJyyYoSKjmNxj777D13HKYXyV3dUSztCOlao4y3V69KBDy6Wh01ZFjbexADOl_hMlAIoEbQpCe-3CSbFnBO4XfkEq7thUbthKezbx_3uyH_Twf4CJ0C1bg</recordid><startdate>20241030</startdate><enddate>20241030</enddate><creator>Wei, Xuanhe</creator><creator>Miao, Youming</creator><creator>Jin, Xiao</creator><creator>Loh, Tian Hong</creator><creator>Liu, Gui</creator><general>MDPI AG</general><general>MDPI</general><scope>NPM</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>3V.</scope><scope>7X7</scope><scope>7XB</scope><scope>88E</scope><scope>8FI</scope><scope>8FJ</scope><scope>8FK</scope><scope>ABUWG</scope><scope>AFKRA</scope><scope>AZQEC</scope><scope>BENPR</scope><scope>CCPQU</scope><scope>DWQXO</scope><scope>FYUFA</scope><scope>GHDGH</scope><scope>K9.</scope><scope>M0S</scope><scope>M1P</scope><scope>PIMPY</scope><scope>PQEST</scope><scope>PQQKQ</scope><scope>PQUKI</scope><scope>PRINS</scope><scope>7X8</scope><scope>5PM</scope><scope>DOA</scope><orcidid>https://orcid.org/0000-0002-3486-2659</orcidid><orcidid>https://orcid.org/0000-0001-5144-5614</orcidid></search><sort><creationdate>20241030</creationdate><title>Design of a Novel SiP Integrated RF Front-End Module Based on SOI Switch and SAW Filter</title><author>Wei, Xuanhe ; Miao, Youming ; Jin, Xiao ; Loh, Tian Hong ; Liu, Gui</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c399t-2cdf31ca195d0d6f8047b376808aa062e18345f31e00ee9768f9061566398add3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2024</creationdate><topic>Acoustics</topic><topic>Code Division Multiple Access</topic><topic>Communications equipment</topic><topic>Data transmission</topic><topic>Design</topic><topic>diversity acceptance</topic><topic>Electric filters</topic><topic>Flexibility</topic><topic>Integrated circuits</topic><topic>Packaging</topic><topic>Processing speed</topic><topic>Radio frequency</topic><topic>RF front-end module</topic><topic>Semiconductors</topic><topic>SiP integration</topic><topic>Switches</topic><topic>User experience</topic><topic>Wireless communications</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Wei, Xuanhe</creatorcontrib><creatorcontrib>Miao, Youming</creatorcontrib><creatorcontrib>Jin, Xiao</creatorcontrib><creatorcontrib>Loh, Tian Hong</creatorcontrib><creatorcontrib>Liu, Gui</creatorcontrib><collection>PubMed</collection><collection>CrossRef</collection><collection>ProQuest Central (Corporate)</collection><collection>Health & Medical Collection (Proquest)</collection><collection>ProQuest Central (purchase pre-March 2016)</collection><collection>Medical Database (Alumni Edition)</collection><collection>Hospital Premium Collection</collection><collection>Hospital Premium Collection (Alumni Edition)</collection><collection>ProQuest Central (Alumni) (purchase pre-March 2016)</collection><collection>ProQuest Central (Alumni)</collection><collection>ProQuest Central</collection><collection>ProQuest Central Essentials</collection><collection>AUTh Library subscriptions: ProQuest Central</collection><collection>ProQuest One Community College</collection><collection>ProQuest Central</collection><collection>Health Research Premium Collection</collection><collection>Health Research Premium Collection (Alumni)</collection><collection>ProQuest Health & Medical Complete (Alumni)</collection><collection>Health & Medical Collection (Alumni Edition)</collection><collection>PML(ProQuest Medical Library)</collection><collection>Publicly Available Content Database (Proquest) (PQ_SDU_P3)</collection><collection>ProQuest One Academic Eastern Edition (DO NOT USE)</collection><collection>ProQuest One Academic</collection><collection>ProQuest One Academic UKI Edition</collection><collection>ProQuest Central China</collection><collection>MEDLINE - Academic</collection><collection>PubMed Central (Full Participant titles)</collection><collection>Open Access: DOAJ - Directory of Open Access Journals</collection><jtitle>Sensors (Basel, Switzerland)</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Wei, Xuanhe</au><au>Miao, Youming</au><au>Jin, Xiao</au><au>Loh, Tian Hong</au><au>Liu, Gui</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Design of a Novel SiP Integrated RF Front-End Module Based on SOI Switch and SAW Filter</atitle><jtitle>Sensors (Basel, Switzerland)</jtitle><addtitle>Sensors (Basel)</addtitle><date>2024-10-30</date><risdate>2024</risdate><volume>24</volume><issue>21</issue><spage>6994</spage><pages>6994-</pages><issn>1424-8220</issn><eissn>1424-8220</eissn><abstract>This paper proposes a novel System-in-Package (SiP) integrated architecture that incorporates Silicon-On-Insulator (SOI) switches and Surface Acoustic Wave (SAW) filters within the chip, aiming to fulfill the demands for miniaturization and multi-functionality for application in emerging wireless technologies. The proposed architecture not only reduces the integration complexity but also considers the architectural design of the integrated module, impedance matching techniques, and signal integrity for carrier aggregation (CA) technology realization. The feasibility of employing SOI switches and SAW filters based on SiP design has been validated through the trial production of a Sub-3GHz radio frequency (RF) front-end diversity receiver module. The resulting RF front-end module demonstrates exceptionally high packaging density and enhanced communication reliability, rendering it suitable for diverse applications in miniaturized RF systems.</abstract><cop>Switzerland</cop><pub>MDPI AG</pub><pmid>39517890</pmid><doi>10.3390/s24216994</doi><orcidid>https://orcid.org/0000-0002-3486-2659</orcidid><orcidid>https://orcid.org/0000-0001-5144-5614</orcidid><oa>free_for_read</oa></addata></record> |
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subjects | Acoustics Code Division Multiple Access Communications equipment Data transmission Design diversity acceptance Electric filters Flexibility Integrated circuits Packaging Processing speed Radio frequency RF front-end module Semiconductors SiP integration Switches User experience Wireless communications |
title | Design of a Novel SiP Integrated RF Front-End Module Based on SOI Switch and SAW Filter |
url | http://sfxeu10.hosted.exlibrisgroup.com/loughborough?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-07T20%3A26%3A49IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-gale_doaj_&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Design%20of%20a%20Novel%20SiP%20Integrated%20RF%20Front-End%20Module%20Based%20on%20SOI%20Switch%20and%20SAW%20Filter&rft.jtitle=Sensors%20(Basel,%20Switzerland)&rft.au=Wei,%20Xuanhe&rft.date=2024-10-30&rft.volume=24&rft.issue=21&rft.spage=6994&rft.pages=6994-&rft.issn=1424-8220&rft.eissn=1424-8220&rft_id=info:doi/10.3390/s24216994&rft_dat=%3Cgale_doaj_%3EA815421825%3C/gale_doaj_%3E%3Cgrp_id%3Ecdi_FETCH-LOGICAL-c399t-2cdf31ca195d0d6f8047b376808aa062e18345f31e00ee9768f9061566398add3%3C/grp_id%3E%3Coa%3E%3C/oa%3E%3Curl%3E%3C/url%3E&rft_id=info:oai/&rft_pqid=3126271173&rft_id=info:pmid/39517890&rft_galeid=A815421825&rfr_iscdi=true |