Feasibility Study of an Automated Assembly Process for Ultrathin Chips

This paper presents a feasibility study of an automated pick-and-place process for ultrathin chips on a standard automatic assembly machine. So far, scientific research about automated assembly of ultrathin chips, with thicknesses less than 50 µm, is missing, but is necessary for cost-effective, hig...

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Bibliographic Details
Published in:Micromachines (Basel) 2020-06, Vol.11 (7), p.654
Main Authors: Janek, Florian, Saller, Ebru, Müller, Ernst, Meißner, Thomas, Weser, Sascha, Barth, Maximilian, Eberhardt, Wolfgang, Zimmermann, André
Format: Article
Language:English
Subjects:
Adhesive bonding
Assembly machines
automated assembly
Automation
Biomedical materials
Bond strength
Epoxy adhesives
Feasibility studies
Foils
Glass substrates
system-in-foil
Thickness
ultrathin chips
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Summary:This paper presents a feasibility study of an automated pick-and-place process for ultrathin chips on a standard automatic assembly machine. So far, scientific research about automated assembly of ultrathin chips, with thicknesses less than 50 µm, is missing, but is necessary for cost-effective, high-quantity production of system-in-foil for applications in narrow spaces or flexible smart health systems applied in biomedical applications. Novel pick-and-place tools for ultrathin chip handling were fabricated and a process for chip detachment from thermal release foil was developed. On this basis, an adhesive bonding process for ultrathin chips with 30 µm thickness was developed and transferred to an automatic assembly machine. Multiple ultrathin chips aligned to each other were automatically placed and transferred onto glass and polyimide foil with a relative placement accuracy of ±25 µm.
ISSN:2072-666X
2072-666X
DOI:10.3390/mi11070654