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Advanced electrodes for electrochemical energy storage and conversion devices fabricated by reactive spray deposition technology
•RSDT is an advanced catalyst synthesis and thin film fabrication process.•Thin films can be deposited by RSDT on temperature sensitive substrates.•RSDT allows for fabrication of porous or dense films depending on the application.•RSDT-fabricated electrodes operate with high performance. While diffe...
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Published in: | Electrochemistry communications 2021-12, Vol.133 (C), p.107162, Article 107162 |
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Main Authors: | , , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | •RSDT is an advanced catalyst synthesis and thin film fabrication process.•Thin films can be deposited by RSDT on temperature sensitive substrates.•RSDT allows for fabrication of porous or dense films depending on the application.•RSDT-fabricated electrodes operate with high performance.
While different electrochemical devices require electrodes with different microstructures, thicknesses, and catalyst compositions, the reactive spray deposition technology (RSDT) process has been able to demonstrate flexibility to provide what is needed for each application. From developing porous electrodes with platinum group metal catalysts for fuel cell and electrolysis applications, to the fabrication of dense ceramic thin films for solid oxide fuel cell electrolytes, to the fabrication of novel electrodes for rechargeable lithium-ion batteries, the RSDT can be modified to fabricate these layers in a one-step process. Using a combustion flame, the heat generated from the flame is used to provide the energy for sintering ceramic particles into a dense layer and it can be used to decompose a precursor solution into a catalyst particle that contains the desired stoichiometry. The RSDT process has been shown to be an effective method for the development of electrode thin films. |
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ISSN: | 1388-2481 1873-1902 |
DOI: | 10.1016/j.elecom.2021.107162 |