Microfabrication Technologies for Interaction Circuits of THz Vacuum Electronic Devices

Advances in manufacturing technology are allowing for the realization of interaction circuit with microstructures. The capability to produce small circuit structures is allowing new opportunities for vacuum electronic devices producing terahertz (THz) frequency radiation, which is impractical with t...

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Bibliographic Details
Published in:Micromachines (Basel) 2024-11, Vol.15 (11), p.1357
Main Authors: Li, Xinghui, Feng, Jinjun
Format: Article
Language:English
Subjects:
Accuracy
Bandwidths
Circuits
Copper
Electronic devices
Electrons
FWG
interaction circuit
Laser etching
LIGA process
LIGA/UV-LIGA
Machining
Manufacturing
microfabrication
Milling (machining)
Numerical controls
Radiation
Reactive ion etching
Review
Technology application
THz
vacuum electronics device
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Summary:Advances in manufacturing technology are allowing for the realization of interaction circuit with microstructures. The capability to produce small circuit structures is allowing new opportunities for vacuum electronic devices producing terahertz (THz) frequency radiation, which is impractical with traditional machining technology. This publication reviews recent progress on advanced microfabrication technologies applicable to interaction circuits of THz vacuum electronic devices, including LIGA/UV-LIGA (Ultraviolet Lithographic, Galvonoformung and Abformung), deep reactive ion etching (DRIE), micro/nano computer numerical control (CNC) milling, three-dimension (3D) printing, etc., and describes the current State-of-the-Art of their applications.
ISSN:2072-666X
2072-666X
DOI:10.3390/mi15111357