Investigation of growth characteristics and semimetal–semiconductor transition of polycrystalline bismuth thin films

• Published in: IUCrJ 2020-01, Vol.7 (1), p.49-57
• Main Authors: Wang, Nan, Dai, Yu-Xiang, Wang, Tian-Lin, Yang, Hua-Zhe, Qi, Yang
• Format: Article
• Language: English
• Subjects: Epitaxy; low-melting metals; Metallic films; molecular beam epitaxy; polycrystalline bi thin films; semimetal–semiconductor transitions; structure-zone models; surface roughness; Thin films
• ISSN: 2052-2525; 2052-2525
• DOI: 10.1107/S2052252519015458

The preferred orientation growth characteristics and surface roughness of polycrystalline bismuth (Bi) thin films fabricated on glass substrates using the molecular beam epitaxy method were investigated at temperatures ranging from 18 to 150°C. The crystallization and morphology were analyzed in detail and the polycrystalline metal film structure-zone model (SZM) was modified to fit the polycrystalline Bi thin film. The boundary temperature between Zone T and Zone II in the SZM shifted to higher temperatures with the increase in film thickness or the decrease of growth rate. Furthermore, the effect of the thickness and surface roughness on the transport properties was investigated, especially for Bi thin films in Zone II. A two-transport channels model was adopted to reveal the influence of the film thickness on the competition between the metallic surface states and the semiconducting bulk states, which is consistent with the results of Bi single-crystal films. Therefore, the polycrystalline Bi thin films are expected to replace the single-crystal films in the application of spintronic devices.