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Computational study of three-dimensional flow and heat transfer of 25 nm Cu–H2O nanoliquid with convective thermal condition and radiative heat flux using modified Buongiorno model

The three-dimensional steady flow of an incompressible 25 nm water-based copper nanoliquid over a bi-directional elongated surface with convective thermal boundary condition is studied. This work may meet various thermal engineering applications for instance thermal energy exchangers, solar energy c...

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Bibliographic Details
Published in:Case studies in thermal engineering 2021-10, Vol.27, p.101340, Article 101340
Main Authors: Rana, Puneet, Srikantha, N., Muhammad, Taseer, Gupta, Gaurav
Format: Article
Language:English
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Summary:The three-dimensional steady flow of an incompressible 25 nm water-based copper nanoliquid over a bi-directional elongated surface with convective thermal boundary condition is studied. This work may meet various thermal engineering applications for instance thermal energy exchangers, solar energy collectors, geophysical transports, radiators, electronic cooling devices, and nuclear reactors. Corcione's model for effective thermal conductivity and dynamic viscosity is used in conjunction with correlations based on effective medium theory for density, specific heat, and electrical conductivity. The effects of radiative heat and convective thermal energy conditions are also taken into account. Modified Buongiorno inhomogeneous model-based governing equations transmuted to nonlinear ordinary boundary value problem. The subsequent system has been deciphered using computer algebraic system software. The method used is validated against the available data and found an exceptional agreement. Two dimensional charts are designed to analyze the impact of the key parameters involved in the model. Three dimensional surface plots are plotted for the study of the Nusselt number, friction coefficients, and Sherwood number values are tabulated for several key parameters. A regression analysis is also performed for the local Nusselt number.
ISSN:2214-157X
2214-157X
DOI:10.1016/j.csite.2021.101340