EMI shielding leadless package solution for automotive

As components get closer together and more devices are integrated into a package, electromagnetic interference (EMI) is one of the most common concerns to be addressed. EMI shielding is not a new topic and its technology has widely been applied to consumer/communication products. However, mainstream...

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Bibliographic Details
Published in:Journal of advanced joining processes 2022-06, Vol.5, p.100102, Article 100102
Main Authors: Kim, ByongJin, Jeon, HyeongIl, Park, DaeYoung, Kim, GiJeong, Cho, Nam-Hee, Khim, JinYoung
Format: Article
Language:English
Subjects:
Automotive
EMI
QFN
rtMLF
Semiconductor packaging
Shielding
Simulation
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Summary:As components get closer together and more devices are integrated into a package, electromagnetic interference (EMI) is one of the most common concerns to be addressed. EMI shielding is not a new topic and its technology has widely been applied to consumer/communication products. However, mainstream products for the automotive market have no clear solution yet. Although leadframe packages, such as Microleadframe® (MLF®)/QFN, are extremely popular for automotive, it is hard to apply EMI technology at the package level because the leads are exposed at the side. In this paper, EMI shielding technology that can be applied to leadframe packages has been studied with the routable MLF (rtMLF®) package. A package structure and layout that give full EMI shielding coverage including the leads is proposed. The shield effectiveness was compared by simulation tests between MLF and RtMLF packages. Also, actual samples were manufactured that confirmed the process and revealed no abnormalities in the conformal shield layer.
ISSN:2666-3309
2666-3309
DOI:10.1016/j.jajp.2022.100102