High-Resolution Patterning of Organic Emitting-Layer by Using Inkjet Printing and Sublimation Transfer Process

We implemented ultra-high resolution patterns of 2822 pixels-per-inch (PPI) via an inkjet printing and vacuum drying process grafted onto a sublimation transfer process. Co-solvented ink with a 1:1 ratio of N,N-dimethylformamide (DMF) to ortho-dichlrorobenzene (oDCB) was used, and the inkjet driving...

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Bibliographic Details
Published in:Nanomaterials (Basel, Switzerland) Switzerland), 2022-05, Vol.12 (9), p.1611
Main Authors: Lee, Jun Yeub, Ju, Byeong-Kwon, Cho, Kwan Hyun
Format: Article
Language:English
Subjects:
co-solvented ink
Dimethylformamide
Glass substrates
High resolution
high resolution patterning
Inkjet printing
Inks
Methods
Microchannels
Morphology
ohnesorge number
Printing
Spin coating
Sublimation
sublimation transfer process
Substrates
Thin films
Vacuum
Vacuum drying
vacuum drying process
Waveforms
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Summary:We implemented ultra-high resolution patterns of 2822 pixels-per-inch (PPI) via an inkjet printing and vacuum drying process grafted onto a sublimation transfer process. Co-solvented ink with a 1:1 ratio of N,N-dimethylformamide (DMF) to ortho-dichlrorobenzene (oDCB) was used, and the inkjet driving waveform was optimized via analysis of Ohnesorge (Oh)-Reynolds (Re) numbers. Inkjet printing conditions on the donor substrate with 2822 PPI microchannels were investigated in detail according to the drop space and line space. Most sublimation transferred patterns have porous surfaces under drying conditions in an air atmosphere. Unlike the spin-coating process, the drying process of inkjet-printed films on the microchannel has a great effect on the sublimation of transferred thin film. Therefore, to control the morphology, we carefully investigated the drying process of the inkjet-printed inks in the microchannel. Using a vacuum drying process to control the morphology of inkjet-printed films, line patterns of 2822 PPI resolution having a root-mean-square (RMS) roughness of 1.331 nm without voids were successfully fabricated.
ISSN:2079-4991
2079-4991
DOI:10.3390/nano12091611