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Designing Inorganic Semiconductors with Cold‐Rolling Processability
While metals can be readily processed and reshaped by cold rolling, most bulk inorganic semiconductors are brittle materials that tend to fracture when plastically deformed. Manufacturing thin sheets and foils of inorganic semiconductors is therefore a bottleneck problem, severely restricting their...
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Published in: | Advanced science 2022-10, Vol.9 (30), p.e2203776-n/a |
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description | While metals can be readily processed and reshaped by cold rolling, most bulk inorganic semiconductors are brittle materials that tend to fracture when plastically deformed. Manufacturing thin sheets and foils of inorganic semiconductors is therefore a bottleneck problem, severely restricting their use in flexible electronic applications. It is recently reported that a few single‐crystalline 2D van der Waals (vdW) semiconductors, such as InSe, are deformable under compressive stress. Here it is demonstrated that intralayer fracture toughness can be tailored via compositional design to make inorganic semiconductors processable by cold rolling. Systematic ab initio calculations covering a range of van der Waals semiconductors homologous to InSe are reported, leading to material‐property maps that forecast trends in both the susceptibility to interlayer slip and the intralayer fracture toughness against cracking. GaSe is predicted, and experimentally confirmed, to be practically amenable to being rolled to large (three quarters) thickness reduction and length extension by a factor of three. The fracture toughness and cleavage energy are predicted to be 0.25 MPa m0.5 and 15 meV Å−2, respectively. The findings open a new realm of possibility for alloy selection and design toward processing‐friendly group‐III chalcogenides for practical applications.
Systematic ab initio calculations of van der Waals semiconductors homologous to InSe are reported, leading to material‐property maps that forecast trends in both the susceptibility to interlayer slip and the intralayer fracture toughness against cracking. The cold‐rolling shaping capability of GaSe is validated in experiments. This work offers alloy selection and design toward processing‐friendly group‐III chalcogenides for practical applications. |
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Systematic ab initio calculations of van der Waals semiconductors homologous to InSe are reported, leading to material‐property maps that forecast trends in both the susceptibility to interlayer slip and the intralayer fracture toughness against cracking. The cold‐rolling shaping capability of GaSe is validated in experiments. This work offers alloy selection and design toward processing‐friendly group‐III chalcogenides for practical applications.</description><identifier>ISSN: 2198-3844</identifier><identifier>EISSN: 2198-3844</identifier><identifier>DOI: 10.1002/advs.202203776</identifier><identifier>PMID: 35981888</identifier><language>eng</language><publisher>Germany: John Wiley & Sons, Inc</publisher><subject>cold‐rolling processability ; deformable inorganic semiconductors ; Deformation ; Experiments ; fracture toughness ; group‐III chalcogenides ; materials design ; Morphology ; Scanning electron microscopy ; Semiconductors ; Stress concentration ; Transmission electron microscopy</subject><ispartof>Advanced science, 2022-10, Vol.9 (30), p.e2203776-n/a</ispartof><rights>2022 The Authors. Advanced Science published by Wiley‐VCH GmbH</rights><rights>2022 The Authors. Advanced Science published by Wiley-VCH GmbH.</rights><rights>2022. This work is published under http://creativecommons.org/licenses/by/4.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.</rights><lds50>peer_reviewed</lds50><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c5291-4e0d348cf49d3e7355bcf108ece12c72a467f59d1118c1703264de42449874e33</citedby><cites>FETCH-LOGICAL-c5291-4e0d348cf49d3e7355bcf108ece12c72a467f59d1118c1703264de42449874e33</cites><orcidid>0000-0002-0720-4781</orcidid></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://www.proquest.com/docview/2728314141/fulltextPDF?pq-origsite=primo$$EPDF$$P50$$Gproquest$$Hfree_for_read</linktopdf><linktohtml>$$Uhttps://www.proquest.com/docview/2728314141?pq-origsite=primo$$EHTML$$P50$$Gproquest$$Hfree_for_read</linktohtml><link.rule.ids>230,314,723,776,780,881,11541,25731,27901,27902,36989,36990,44566,46027,46451,53766,53768,74869</link.rule.ids><backlink>$$Uhttps://www.ncbi.nlm.nih.gov/pubmed/35981888$$D View this record in MEDLINE/PubMed$$Hfree_for_read</backlink></links><search><creatorcontrib>Wang, Xu‐Dong</creatorcontrib><creatorcontrib>Tan, Jieling</creatorcontrib><creatorcontrib>Ouyang, Jian</creatorcontrib><creatorcontrib>Zhang, Hang‐Ming</creatorcontrib><creatorcontrib>Wang, Jiang‐Jing</creatorcontrib><creatorcontrib>Wang, Yuecun</creatorcontrib><creatorcontrib>Deringer, Volker L.</creatorcontrib><creatorcontrib>Zhou, Jian</creatorcontrib><creatorcontrib>Zhang, Wei</creatorcontrib><creatorcontrib>Ma, En</creatorcontrib><title>Designing Inorganic Semiconductors with Cold‐Rolling Processability</title><title>Advanced science</title><addtitle>Adv Sci (Weinh)</addtitle><description>While metals can be readily processed and reshaped by cold rolling, most bulk inorganic semiconductors are brittle materials that tend to fracture when plastically deformed. Manufacturing thin sheets and foils of inorganic semiconductors is therefore a bottleneck problem, severely restricting their use in flexible electronic applications. It is recently reported that a few single‐crystalline 2D van der Waals (vdW) semiconductors, such as InSe, are deformable under compressive stress. Here it is demonstrated that intralayer fracture toughness can be tailored via compositional design to make inorganic semiconductors processable by cold rolling. Systematic ab initio calculations covering a range of van der Waals semiconductors homologous to InSe are reported, leading to material‐property maps that forecast trends in both the susceptibility to interlayer slip and the intralayer fracture toughness against cracking. GaSe is predicted, and experimentally confirmed, to be practically amenable to being rolled to large (three quarters) thickness reduction and length extension by a factor of three. The fracture toughness and cleavage energy are predicted to be 0.25 MPa m0.5 and 15 meV Å−2, respectively. The findings open a new realm of possibility for alloy selection and design toward processing‐friendly group‐III chalcogenides for practical applications.
Systematic ab initio calculations of van der Waals semiconductors homologous to InSe are reported, leading to material‐property maps that forecast trends in both the susceptibility to interlayer slip and the intralayer fracture toughness against cracking. The cold‐rolling shaping capability of GaSe is validated in experiments. This work offers alloy selection and design toward processing‐friendly group‐III chalcogenides for practical applications.</description><subject>cold‐rolling processability</subject><subject>deformable inorganic semiconductors</subject><subject>Deformation</subject><subject>Experiments</subject><subject>fracture toughness</subject><subject>group‐III chalcogenides</subject><subject>materials design</subject><subject>Morphology</subject><subject>Scanning electron microscopy</subject><subject>Semiconductors</subject><subject>Stress concentration</subject><subject>Transmission electron microscopy</subject><issn>2198-3844</issn><issn>2198-3844</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2022</creationdate><recordtype>article</recordtype><sourceid>24P</sourceid><sourceid>PIMPY</sourceid><sourceid>DOA</sourceid><recordid>eNqFkctuEzEUhkcIRKvSLUsUiQ2bBB9fxvYGqUovRKoEosDWcuwzqSNnXOxJq-x4BJ6xT4JDStSyYWXL_vzpP_6b5jWQCRBC31t_WyaUUEqYlO2z5pCCVmOmOH_-aH_QHJeyJISAYJKDetkcMKEVKKUOm7NTLGHRh34xmvUpL2wf3OgKV8Gl3q_dkHIZ3YXhejRN0d___PUlxbiFP-fksBQ7DzEMm1fNi87GgscP61Hz7fzs6_Tj-PLTxWx6cjl2gmoYcySeceU6rj1DyYSYuw6IQodAnaSWt7IT2gOAciAJoy33yCnnWkmOjB01s53XJ7s0NzmsbN6YZIP5c1DzG5uH4CIaJn1rKSHeCeDguRY4J4BWtF0LQNvq-rBz3aznK_QO-yHb-ET69KYP12aRbo0WulWCV8G7B0FOP9ZYBrMKxWGMtse0LoZKwlWrmKYVffsPukzr3NevqhRVrCbkUKnJjnI5lZKx24cBYraFm23hZl94ffDm8Qh7_G-9FeA74C5E3PxHZ05Ov19xToH9Bjxntow</recordid><startdate>20221001</startdate><enddate>20221001</enddate><creator>Wang, Xu‐Dong</creator><creator>Tan, Jieling</creator><creator>Ouyang, Jian</creator><creator>Zhang, Hang‐Ming</creator><creator>Wang, Jiang‐Jing</creator><creator>Wang, Yuecun</creator><creator>Deringer, Volker L.</creator><creator>Zhou, Jian</creator><creator>Zhang, Wei</creator><creator>Ma, En</creator><general>John Wiley & Sons, Inc</general><general>John Wiley and Sons Inc</general><general>Wiley</general><scope>24P</scope><scope>NPM</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>3V.</scope><scope>7XB</scope><scope>88I</scope><scope>8FK</scope><scope>8G5</scope><scope>ABUWG</scope><scope>AFKRA</scope><scope>AZQEC</scope><scope>BENPR</scope><scope>CCPQU</scope><scope>DWQXO</scope><scope>GNUQQ</scope><scope>GUQSH</scope><scope>HCIFZ</scope><scope>M2O</scope><scope>M2P</scope><scope>MBDVC</scope><scope>PIMPY</scope><scope>PQEST</scope><scope>PQQKQ</scope><scope>PQUKI</scope><scope>PRINS</scope><scope>Q9U</scope><scope>7X8</scope><scope>5PM</scope><scope>DOA</scope><orcidid>https://orcid.org/0000-0002-0720-4781</orcidid></search><sort><creationdate>20221001</creationdate><title>Designing Inorganic Semiconductors with Cold‐Rolling Processability</title><author>Wang, Xu‐Dong ; Tan, Jieling ; Ouyang, Jian ; Zhang, Hang‐Ming ; Wang, Jiang‐Jing ; Wang, Yuecun ; Deringer, Volker L. ; Zhou, Jian ; Zhang, Wei ; Ma, En</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c5291-4e0d348cf49d3e7355bcf108ece12c72a467f59d1118c1703264de42449874e33</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2022</creationdate><topic>cold‐rolling processability</topic><topic>deformable inorganic semiconductors</topic><topic>Deformation</topic><topic>Experiments</topic><topic>fracture toughness</topic><topic>group‐III chalcogenides</topic><topic>materials design</topic><topic>Morphology</topic><topic>Scanning electron microscopy</topic><topic>Semiconductors</topic><topic>Stress concentration</topic><topic>Transmission electron microscopy</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Wang, Xu‐Dong</creatorcontrib><creatorcontrib>Tan, Jieling</creatorcontrib><creatorcontrib>Ouyang, Jian</creatorcontrib><creatorcontrib>Zhang, Hang‐Ming</creatorcontrib><creatorcontrib>Wang, Jiang‐Jing</creatorcontrib><creatorcontrib>Wang, Yuecun</creatorcontrib><creatorcontrib>Deringer, Volker L.</creatorcontrib><creatorcontrib>Zhou, Jian</creatorcontrib><creatorcontrib>Zhang, Wei</creatorcontrib><creatorcontrib>Ma, En</creatorcontrib><collection>Wiley Online Library Open Access</collection><collection>PubMed</collection><collection>CrossRef</collection><collection>ProQuest Central (Corporate)</collection><collection>ProQuest Central (purchase pre-March 2016)</collection><collection>Science Database (Alumni Edition)</collection><collection>ProQuest Central (Alumni) (purchase pre-March 2016)</collection><collection>Research Library (Alumni Edition)</collection><collection>ProQuest Central (Alumni Edition)</collection><collection>ProQuest Central UK/Ireland</collection><collection>ProQuest Central Essentials</collection><collection>ProQuest Central</collection><collection>ProQuest One Community College</collection><collection>ProQuest Central Korea</collection><collection>ProQuest Central Student</collection><collection>Research Library Prep</collection><collection>SciTech Premium Collection</collection><collection>Research Library</collection><collection>Science Database</collection><collection>Research Library (Corporate)</collection><collection>Publicly Available Content Database</collection><collection>ProQuest One Academic Eastern Edition (DO NOT USE)</collection><collection>ProQuest One Academic</collection><collection>ProQuest One Academic UKI Edition</collection><collection>ProQuest Central China</collection><collection>ProQuest Central Basic</collection><collection>MEDLINE - Academic</collection><collection>PubMed Central (Full Participant titles)</collection><collection>DOAJ Directory of Open Access Journals</collection><jtitle>Advanced science</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Wang, Xu‐Dong</au><au>Tan, Jieling</au><au>Ouyang, Jian</au><au>Zhang, Hang‐Ming</au><au>Wang, Jiang‐Jing</au><au>Wang, Yuecun</au><au>Deringer, Volker L.</au><au>Zhou, Jian</au><au>Zhang, Wei</au><au>Ma, En</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Designing Inorganic Semiconductors with Cold‐Rolling Processability</atitle><jtitle>Advanced science</jtitle><addtitle>Adv Sci (Weinh)</addtitle><date>2022-10-01</date><risdate>2022</risdate><volume>9</volume><issue>30</issue><spage>e2203776</spage><epage>n/a</epage><pages>e2203776-n/a</pages><issn>2198-3844</issn><eissn>2198-3844</eissn><abstract>While metals can be readily processed and reshaped by cold rolling, most bulk inorganic semiconductors are brittle materials that tend to fracture when plastically deformed. Manufacturing thin sheets and foils of inorganic semiconductors is therefore a bottleneck problem, severely restricting their use in flexible electronic applications. It is recently reported that a few single‐crystalline 2D van der Waals (vdW) semiconductors, such as InSe, are deformable under compressive stress. Here it is demonstrated that intralayer fracture toughness can be tailored via compositional design to make inorganic semiconductors processable by cold rolling. Systematic ab initio calculations covering a range of van der Waals semiconductors homologous to InSe are reported, leading to material‐property maps that forecast trends in both the susceptibility to interlayer slip and the intralayer fracture toughness against cracking. GaSe is predicted, and experimentally confirmed, to be practically amenable to being rolled to large (three quarters) thickness reduction and length extension by a factor of three. The fracture toughness and cleavage energy are predicted to be 0.25 MPa m0.5 and 15 meV Å−2, respectively. The findings open a new realm of possibility for alloy selection and design toward processing‐friendly group‐III chalcogenides for practical applications.
Systematic ab initio calculations of van der Waals semiconductors homologous to InSe are reported, leading to material‐property maps that forecast trends in both the susceptibility to interlayer slip and the intralayer fracture toughness against cracking. The cold‐rolling shaping capability of GaSe is validated in experiments. This work offers alloy selection and design toward processing‐friendly group‐III chalcogenides for practical applications.</abstract><cop>Germany</cop><pub>John Wiley & Sons, Inc</pub><pmid>35981888</pmid><doi>10.1002/advs.202203776</doi><tpages>9</tpages><orcidid>https://orcid.org/0000-0002-0720-4781</orcidid><oa>free_for_read</oa></addata></record> |
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subjects | cold‐rolling processability deformable inorganic semiconductors Deformation Experiments fracture toughness group‐III chalcogenides materials design Morphology Scanning electron microscopy Semiconductors Stress concentration Transmission electron microscopy |
title | Designing Inorganic Semiconductors with Cold‐Rolling Processability |
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