Co-Design Method and Wafer-Level Packaging Technique of Thin-Film Flexible Antenna and Silicon CMOS Rectifier Chips for Wireless-Powered Neural Interface Systems

In this paper, a co-design method and a wafer-level packaging technique of a flexible antenna and a CMOS rectifier chip for use in a small-sized implantable system on the brain surface are proposed. The proposed co-design method optimizes the system architecture, and can help avoid the use of extern...

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Bibliographic Details
Published in:Sensors (Basel, Switzerland) Switzerland), 2015-12, Vol.15 (12), p.31821-31832
Main Authors: Okabe, Kenji, Jeewan, Horagodage Prabhath, Yamagiwa, Shota, Kawano, Takeshi, Ishida, Makoto, Akita, Ippei
Format: Article
Language:English
Subjects:
Brain - physiology
flexible substrate
flip-chip bonding
Humans
Neural Prostheses
Prosthesis Design
rectenna
Semiconductors
Silicon - chemistry
Surface Properties
Telemetry - instrumentation
wafer-level packaging
wireless power transmission
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Summary:In this paper, a co-design method and a wafer-level packaging technique of a flexible antenna and a CMOS rectifier chip for use in a small-sized implantable system on the brain surface are proposed. The proposed co-design method optimizes the system architecture, and can help avoid the use of external matching components, resulting in the realization of a small-size system. In addition, the technique employed to assemble a silicon large-scale integration (LSI) chip on the very thin parylene film (5 μm) enables the integration of the rectifier circuits and the flexible antenna (rectenna). In the demonstration of wireless power transmission (WPT), the fabricated flexible rectenna achieved a maximum efficiency of 0.497% with a distance of 3 cm between antennas. In addition, WPT with radio waves allows a misalignment of 185% against antenna size, implying that the misalignment has a less effect on the WPT characteristics compared with electromagnetic induction.
ISSN:1424-8220
1424-8220
DOI:10.3390/s151229885