A Review of System-in-Package Technologies: Application and Reliability of Advanced Packaging

The system-in-package (SiP) has gained much interest in the current rapid development of integrated circuits (ICs) due to its advantages of integration, shrinking, and high density. This review examined the SiP as its focus, provides a list of the most-recent SiP innovations based on market needs, a...

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Bibliographic Details
Published in:Micromachines (Basel) 2023-05, Vol.14 (6), p.1149
Main Authors: Wang, Haoyu, Ma, Jianshe, Yang, Yide, Gong, Mali, Wang, Qinheng
Format: Article
Language:English
Subjects:
advanced packaging
Design optimization
Electrical properties
Forecasts and trends
Innovations
Integrated circuits
Mechanical properties
optimization
Optimization techniques
package reliability
Packaging
Power supply
Reliability
Review
Semiconductor chips
Semiconductors
system-in-package
Technology
Thermal management
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Description
Summary:The system-in-package (SiP) has gained much interest in the current rapid development of integrated circuits (ICs) due to its advantages of integration, shrinking, and high density. This review examined the SiP as its focus, provides a list of the most-recent SiP innovations based on market needs, and discusses how the SiP is used in various fields. Reliability issues must be resolved if the SiP is to operate normally. Three factors-thermal management, mechanical stress and electrical properties-can be paired with specific examples in order to detect and improve package reliability. This review provides a thorough overview of SiP technology, serves as a guide and foundation for the SiP in package reliability design, and addresses the challenges and potential for further development of this kind of package.
ISSN:2072-666X
2072-666X
DOI:10.3390/mi14061149