The Influence of Copper Oxide Particle Size on the Properties of Epoxy Resin

This study examines the relationship between the size of copper particles and the properties of epoxy resin. Epoxy resin is a type of thermosetting resin commonly used as a matrix in polymer matrix composite materials reinforced with glass or carbon fibers. As part of this study, three microscale an...

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Bibliographic Details
Published in:Applied sciences 2024-03, Vol.14 (6), p.2534
Main Authors: Bazan, Patrycja, Gajda, Michał, Nosal, Przemysław, Bąk, Agnieszka, Setlak, Kinga, Łach, Michał
Format: Article
Language:English
Subjects:
ageing
Analysis
Carbon fibers
Composite materials
Contact angle
copper particle size
Corrosion resistance
epoxy resin
Epoxy resins
Interfacial bonding
Mechanical properties
Nanoparticles
Particle size
Polyesters
polymer matrix composite materials
Polymers
Silicon carbide
Tensile strength
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Summary:This study examines the relationship between the size of copper particles and the properties of epoxy resin. Epoxy resin is a type of thermosetting resin commonly used as a matrix in polymer matrix composite materials reinforced with glass or carbon fibers. As part of this study, three microscale and two nanoscale composite samples modified with copper oxide particles of varying sizes were produced. This study included mechanical property tests such as static tensile tests, static bending tests, and impact tests. The results of the strength tests were compared to modeling results. Additionally, an accelerated thermal aging process was conducted to determine the impact of external conditions on the behavior of the produced composites. This study concluded with an analysis of thermal conductivity. The test results revealed that the size of the copper particles significantly impacted the tested properties. The composites with copper oxide particles on the nanoscale demonstrated the best results. These composites have promising applications in the automotive and aviation industries due to their strength, resistance to external factors, and increased thermal conductivity, suggesting their potential for producing materials that effectively dissipate heat.
ISSN:2076-3417
2076-3417
DOI:10.3390/app14062534