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Perspectives on UVC LED: Its Progress and Application
High-quality epitaxial layers are directly related to internal quantum efficiency. The methods used to design such epitaxial layers are reviewed in this article. The ultraviolet C (UVC) light-emitting diode (LED) epitaxial layer structure exhibits electron leakage; therefore, many research groups ha...
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Published in: | Photonics 2021-06, Vol.8 (6), p.196 |
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description | High-quality epitaxial layers are directly related to internal quantum efficiency. The methods used to design such epitaxial layers are reviewed in this article. The ultraviolet C (UVC) light-emitting diode (LED) epitaxial layer structure exhibits electron leakage; therefore, many research groups have proposed the design of blocking layers and carrier transportation to generate high electron–hole recombination rates. This also aids in increasing the internal quantum efficiency. The cap layer, p-GaN, exhibits high absorption in deep UV radiation; thus, a small thickness is usually chosen. Flip chip design is more popular for such devices in the UV band, and the main factors for consideration are light extraction and heat transportation. However, the choice of encapsulation materials is important, because unsuitable encapsulation materials will be degraded by ultraviolet light irradiation. A suitable package design can account for light extraction and heat transportation. Finally, an atomic layer deposition Al2O3 film has been proposed as a mesa passivation layer. It can provide a low reverse current leakage. Moreover, it can help increase the quantum efficiency, enhance the moisture resistance, and improve reliability. UVC LED applications can be used in sterilization, water purification, air purification, and medical and military fields. |
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The methods used to design such epitaxial layers are reviewed in this article. The ultraviolet C (UVC) light-emitting diode (LED) epitaxial layer structure exhibits electron leakage; therefore, many research groups have proposed the design of blocking layers and carrier transportation to generate high electron–hole recombination rates. This also aids in increasing the internal quantum efficiency. The cap layer, p-GaN, exhibits high absorption in deep UV radiation; thus, a small thickness is usually chosen. Flip chip design is more popular for such devices in the UV band, and the main factors for consideration are light extraction and heat transportation. However, the choice of encapsulation materials is important, because unsuitable encapsulation materials will be degraded by ultraviolet light irradiation. A suitable package design can account for light extraction and heat transportation. Finally, an atomic layer deposition Al2O3 film has been proposed as a mesa passivation layer. It can provide a low reverse current leakage. Moreover, it can help increase the quantum efficiency, enhance the moisture resistance, and improve reliability. UVC LED applications can be used in sterilization, water purification, air purification, and medical and military fields.</description><identifier>ISSN: 2304-6732</identifier><identifier>EISSN: 2304-6732</identifier><identifier>DOI: 10.3390/photonics8060196</identifier><language>eng</language><publisher>Basel: MDPI AG</publisher><subject>Air purification ; Aluminum oxide ; atomic layer deposition ; Atomic layer epitaxy ; Current leakage ; Design ; disinfection ; Efficiency ; Encapsulation ; Epitaxial layers ; Irradiation ; Lamps ; Light emitting diodes ; Light irradiation ; Materials selection ; Moisture resistance ; Packaging design ; Photodegradation ; Quantum efficiency ; Recombination ; Semiconductors ; Sterilization ; Transportation ; Ultraviolet radiation ; UVC LED ; Water purification</subject><ispartof>Photonics, 2021-06, Vol.8 (6), p.196</ispartof><rights>2021 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). 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The methods used to design such epitaxial layers are reviewed in this article. The ultraviolet C (UVC) light-emitting diode (LED) epitaxial layer structure exhibits electron leakage; therefore, many research groups have proposed the design of blocking layers and carrier transportation to generate high electron–hole recombination rates. This also aids in increasing the internal quantum efficiency. The cap layer, p-GaN, exhibits high absorption in deep UV radiation; thus, a small thickness is usually chosen. Flip chip design is more popular for such devices in the UV band, and the main factors for consideration are light extraction and heat transportation. However, the choice of encapsulation materials is important, because unsuitable encapsulation materials will be degraded by ultraviolet light irradiation. A suitable package design can account for light extraction and heat transportation. Finally, an atomic layer deposition Al2O3 film has been proposed as a mesa passivation layer. 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UVC LED applications can be used in sterilization, water purification, air purification, and medical and military fields.</description><subject>Air purification</subject><subject>Aluminum oxide</subject><subject>atomic layer deposition</subject><subject>Atomic layer epitaxy</subject><subject>Current leakage</subject><subject>Design</subject><subject>disinfection</subject><subject>Efficiency</subject><subject>Encapsulation</subject><subject>Epitaxial layers</subject><subject>Irradiation</subject><subject>Lamps</subject><subject>Light emitting diodes</subject><subject>Light irradiation</subject><subject>Materials selection</subject><subject>Moisture resistance</subject><subject>Packaging design</subject><subject>Photodegradation</subject><subject>Quantum efficiency</subject><subject>Recombination</subject><subject>Semiconductors</subject><subject>Sterilization</subject><subject>Transportation</subject><subject>Ultraviolet radiation</subject><subject>UVC LED</subject><subject>Water 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subjects | Air purification Aluminum oxide atomic layer deposition Atomic layer epitaxy Current leakage Design disinfection Efficiency Encapsulation Epitaxial layers Irradiation Lamps Light emitting diodes Light irradiation Materials selection Moisture resistance Packaging design Photodegradation Quantum efficiency Recombination Semiconductors Sterilization Transportation Ultraviolet radiation UVC LED Water purification |
title | Perspectives on UVC LED: Its Progress and Application |
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