Performance analysis of Cu-MWCNT bundled HCTSVs using ternary logic

• Published in: e-Prime 2023-09, Vol.5, p.100247, Article 100247
• Main Authors: Rajkumar, Katepogu, Reddy, G． Umamaheswara
• Format: Article
• Language: English
• Subjects: CNTs—SWCNT; Cu-MWCNT electrical equivalent circuit models TSV; HCTSVs; MWCNTs
• ISSN: 2772-6711; 2772-6711
• DOI: 10.1016/j.prime.2023.100247

•In ternary logic designs, crosstalk effects are more important due to reduced noise margins over conventional logic due to technical advancements.•This work presents a comparative study on functional crosstalk, dynamic crosstalk, power, PDP, and EDP of ternary logic Cu-MWCNT based HCTSVs with various insulating liners. Because the polymer liners have a low insulating constant, the coupling capacitance between the HCTSVs is reduced.•The SPICE simulations are performed to achieve the performance of the TSVs. The results indicated that the performance of Cu-MWCNT HCTSVs with BCB liner is improved over the other insulating materials. Hence, BCB is the most compatible insulating liner compare to other polymer liners.•Due to its flexibility, adhesion, fluidity, and smooth surface, PPC is considered more effective than BCB in developing ICs. Due to the excellent properties of PPC, it is considered as most suitable insulating material to develop future ICs. This paper presents an investigation of crosstalk issues for coupled heterogeneous coaxial through silicon vias (HCTSVs) in ternary logic. Crosstalk issues are investigated for coupled HCTSVs using Cu-MWCNT as a conductive filler and polymer liners such as polyimide, polypropylene carbonate (PPC), and benzocyclobutene (BCB) as insulating materials. The electrical equivalent circuit model is utilized to investigate the crosstalk induced by the ternary inverter in coupled HCTSVs. The effects of crosstalk such as functional and dynamic crosstalk for proposed HCTSVs are compared with Multi-walled CNT (MWCNT) TSVs using Hewlett simulation program with integrated circuit emphasis (HSPICE) simulations. Other performance parameters are also investigated, including power dissipation, power delay product (PDP), and energy delay product (EDP). The proposed model's crosstalk effects are also investigated for various TSV heights. The BCB-based coupled Cu-MWCNT HCTSVs provide a significant improvement in crosstalk at reduced TSV height. The proposed HCTSVs also improved overall performance by 32.12% when compared to the MWCNT based TSVs. As a result, Cu-MWCNT based HCTSVs with BCB liner are better than conventional TSVs for ternary logic integrated circuits (ICs).