Wetting and interfacial reactions: Experimental study of the Sb-Sn-X (X = Cu, Ni) systems

Experimental studies of the Cu-Sb-Sn and Ni-Sb-Sn systems have been carried out by the wetting tests, followed by the analysis of the microstructural evolution occurring at the interface between the liquid alloy and solid substrate. The wetting experiments on the Sb30Sn70 / (Cu, Ni) and Sb38.4Sn61.6...

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Bibliographic Details
Published in:Journal of mining and metallurgy. Section B, Metallurgy Metallurgy, 2018, Vol.54 (2), p.251-260
Main Authors: Novakovic, R.M., Delsante, S., Borzone, G.
Format: Article
Language:English
Subjects:
Alloys
Antimony base alloys
CALPHAD
Contact angle
Copper
Cu-and Ni-substrates
Experiments
High temperature
Interface reactions
Interfaces
Lead content
Liquid alloys
Nickel
Phase diagrams
Sb-Sn Alloys
Substrates
Tin
Wetting
Wetting experiments
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Summary:Experimental studies of the Cu-Sb-Sn and Ni-Sb-Sn systems have been carried out by the wetting tests, followed by the analysis of the microstructural evolution occurring at the interface between the liquid alloy and solid substrate. The wetting experiments on the Sb30Sn70 / (Cu, Ni) and Sb38.4Sn61.6 / (Cu, Ni) systems have been performed by using a sessile drop apparatus. The wetting behaviour of the two alloys in contact with Cu-substrate differs from that observed in the case of Ni-substrate. The Sb-Sn alloy / substrate interface was characterised by SEM-EDS analyses. For each system, the solidliquid interactions and the phases formed at the interface were studied with the help of the corresponding phase diagrams. nema
ISSN:1450-5339
2217-7175
DOI:10.2298/JMMB180124013N