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Dynamic on‐state resistance instability characterization of a multi‐chip‐GaN MIS‐HEMTs cascode power module

The dynamic on‐state resistance instability of a high‐current cascode multi‐GaN‐chip power module under high frequency and voltage switching conditions is demonstrated in this paper. The presented double pulse test topology is utilized to evaluate switching dependencies on voltage, current, and freq...

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Bibliographic Details
Published in:Electronics letters 2023-07, Vol.59 (13), p.n/a
Main Authors: Elangovan, Surya, Cheng, Stone, Jang, Wen‐Yea, Chang, Edward Yi
Format: Article
Language:English
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Summary:The dynamic on‐state resistance instability of a high‐current cascode multi‐GaN‐chip power module under high frequency and voltage switching conditions is demonstrated in this paper. The presented double pulse test topology is utilized to evaluate switching dependencies on voltage, current, and frequency, showing its versatility in investigating the switching instability of the device. The extended defects in the buffer layer resulted in a decrease in dynamic on‐state resistance (RDS‐ON) under hard switching conditions. Despite this, no noticeable RDS‐ON degradation occurs under harsh switching conditions due to electron de‐trapping. This study comprehensively analyzes the dynamic stability of a multi‐GaN‐chip cascode module with devices. The dynamic on‐state resistance instability of a high‐current cascode multi‐GaN‐chip power module under high frequency and voltage switching conditions is demonstrated in this paper. The extended defects in the buffer layer resulted in a decrease in dynamic on‐state resistance under hard switching conditions. This study comprehensively analyzed the dynamic stability of a multi‐GaN‐chip cascode module with two GaN cascode switches.
ISSN:0013-5194
1350-911X
DOI:10.1049/ell2.12824