Microtensile bond strength of glass ionomer cements to a resin composite using universal bonding agents with and without acid etching

• Published in: Heliyon 2022-02, Vol.8 (2), p.e08858, Article e08858
• Main Authors: Farshidfar, Nima, Agharokh, Mahya, Ferooz, Maryam, Bagheri, Rafat
• Format: Article
• Language: English
• Subjects: Acid etching; encapsulation; epoxides; glass; Glass ionomer cements; Microtensile bond strength; nanohybrids; phosphoric acid; polytetrafluoroethylene; Resin composite; Universal bonding agents
• ISSN: 2405-8440; 2405-8440
• DOI: 10.1016/j.heliyon.2022.e08858

To assess the effect of two universal bonding agents on the microtensile bond strength (μTBS) of encapsulated conventional glass ionomers (CGICs) and resin-modified glass ionomers (RMGICs) to a resin composite, with or without the use of 35% phosphoric acid. Four materials were used in this study: Riva Self-cure and Riva Light-cure; SDI and Equia Forte Fil and Fuji II LC; GC. The specimens were prepared in Teflon moulds with half the specimens for each GIC etched using 35% phosphoric acid (Ultra-Etch) and the remainder not etched. Each group was randomly subdivided into three groups, where the first two groups received an air-thin layer of bonding agent (G-Premio Bond = GPB or Clearfil Universal Bond = CUB) then light cured; and the third group had no bonding agent. For all groups, a nanohybrid composite (GC Kalore; GC) was placed incrementally on the GIC. Following 24 h immersion in distilled water, each block was embedded in epoxy resin in a cubic mould and sectioned by a cutting device. The stick specimens were then subjected to μTBS testing. The application of both universal bonding agents significantly enhanced the μTBS of all GICs (p < 0.001). Both RMGICs exhibited higher μTBS compared to that of CGICs (p < 0.001). The application of universal bonding agents with acid etching significantly increased the μTBS of both CGICs and RMGICs to resin composite in contrast to without acid etching. Using 35% phosphoric acid for 15 s prior to the application of universal bonding agents improved the μTBS of GIC to resin composite. Using Universal bonding agents with 15 s acid etching may increase the bond strength of both CGICs and RMGICs to resin composite when utilising the sandwich technique. Resin composite; Glass ionomer cements; Universal bonding agents; Microtensile bond strength; Acid etching.