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The Impact of a Taper Impedance Transformation on the TRL De-Embedding Error
This work originates from the realization that, in a transformed impedance thru-reflect-line (TRL) calibration, the sensitivity to random measurement errors is affected by impedance discrepancies between the impedance transformer and the device-under-test (DUT). Through a thorough exploration that i...
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Published in: | IEEE journal of microwaves 2024-07, Vol.4 (3), p.389-403 |
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Main Authors: | , , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites |
Online Access: | Get full text |
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Summary: | This work originates from the realization that, in a transformed impedance thru-reflect-line (TRL) calibration, the sensitivity to random measurement errors is affected by impedance discrepancies between the impedance transformer and the device-under-test (DUT). Through a thorough exploration that includes theoretical analysis, simulations and TRL measurements, this study establishes that the accuracy of de-embedding operations on a transformed impedance medium is intricately tied to the difference between the Thevenin impedance seen from the DUT-side of the launcher and the DUT impedance. A noteworthy finding is that minimizing this difference enhances the resilience of the de-embedding process against random measurement errors, being advantageous for precision modeling techniques, and demonstrating the importance of considering those concepts when designing an access structure to a DUT. |
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ISSN: | 2692-8388 2692-8388 |
DOI: | 10.1109/JMW.2024.3405018 |