Advanced Atomic Layer Deposition Technologies for Micro-LEDs and VCSELs

In recent years, the process requirements of nano-devices have led to the gradual reduction in the scale of semiconductor devices, and the consequent non-negligible sidewall defects caused by etching. Since plasma-enhanced chemical vapor deposition can no longer provide sufficient step coverage, the...

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Bibliographic Details
Published in:Nanoscale research letters 2021-11, Vol.16 (1), p.164-164, Article 164
Main Authors: Yeh, Yen-Wei, Lin, Su-Hui, Hsu, Tsung-Chi, Lai, Shouqiang, Lee, Po-Tsung, Lien, Shui-Yang, Wuu, Dong-Sing, Li, Guisen, Chen, Zhong, Wu, Tingzhu, Kuo, Hao-Chung
Format: Article
Language:English
Subjects:
ALD
Atomic layer epitaxy
Chemical reactions
Chemical vapor deposition
Chemistry and Materials Science
Efficiency
Engineering
Etching
Lasers
Light emitting diodes
Materials Science
Micro-LED
Molecular Medicine
Nano Review
Nanochemistry
Nanoscale Science and Technology
Nanotechnology
Nanotechnology and Microengineering
Nanotechnology devices
Passivation
Passivity
Plasma enhanced chemical vapor deposition
R&D
Reliability
Research & development
Semiconductor devices
Substrates
VCSEL
Vertical cavity surface emission lasers
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Summary:In recent years, the process requirements of nano-devices have led to the gradual reduction in the scale of semiconductor devices, and the consequent non-negligible sidewall defects caused by etching. Since plasma-enhanced chemical vapor deposition can no longer provide sufficient step coverage, the characteristics of atomic layer deposition ALD technology are used to solve this problem. ALD utilizes self-limiting interactions between the precursor gas and the substrate surface. When the reactive gas forms a single layer of chemical adsorbed on the substrate surface, no reaction occurs between them and the growth thickness can be controlled. At the Å level, it can provide good step coverage. In this study, recent research on the ALD passivation on micro-light-emitting diodes and vertical cavity surface emitting lasers was reviewed and compared. Several passivation methods were demonstrated to lead to enhanced light efficiency, reduced leakage, and improved reliability.
ISSN:1931-7573
1556-276X
1556-276X
DOI:10.1186/s11671-021-03623-x