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Reinforced copper matrix composites with highly dispersed nano size TiC in-situ generated from the Carbon Polymer Dots
In order to uniformly disperse the ceramic reinforcements synthesized in-situ in the copper matrix composites, this study used Carbon Polymer Dot (CPD) as the carbon source and Cu–1.0%Ti alloy powder as the matrix for supplying Ti source to prepare in-situ synthesized TiC/Cu composites. The results...
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Published in: | Advanced Powder Materials 2023-04, Vol.2 (2), p.100090, Article 100090 |
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Main Authors: | , , , , , , , , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | In order to uniformly disperse the ceramic reinforcements synthesized in-situ in the copper matrix composites, this study used Carbon Polymer Dot (CPD) as the carbon source and Cu–1.0%Ti alloy powder as the matrix for supplying Ti source to prepare in-situ synthesized TiC/Cu composites. The results show that TiC nano-precipitates, having the similar particle sizes with the CPD, form at the grains interior and grain boundaries, and maintain a uniform distribution state. Compared with the matrix, 0.3 wt% CPD/Cu composite displays the best strength-plastic compatibility, the ultimate tensile strength achieves 385 MPa accompanied with a corresponding elongation of 21%, owing to the dislocation hindrance caused by nano-carbide and excellent interface bonding between nano TiC and the Cu matrix. The density function theory calculation supports our experimental results by showing a tighter and stronger interface contact. This work presents a new approach for studying in-situ carbide precipitates.
To create the in situ synthesized nano-sized TiC/Cu composites, Carbon Polymer Dot (CPD) was used as the carbon source. Theoretical and experimental findings support the strong interfacial bonding between TiC and copper matrix. The proposed method of in-situ synthesized nano-scaled TiC demonstrates to be a novel way to construct high-performance Cu matrix composites with both enhanced strength and plasticity. [Display omitted] |
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ISSN: | 2772-834X 2772-834X |
DOI: | 10.1016/j.apmate.2022.100090 |