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Mechanical and microstructural characteristics of additive manufactured material under room and elevated temperatures

Significant advancements in the process of producing information and space have been made possible by the application of additive manufacturing (AM). Geometric patterns and unique designs. This study’s primary goal is to Section the impacts of temperatures ranging from room temperature to high tempe...

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Bibliographic Details
Published in:E3S web of conferences 2024, Vol.564, p.11005
Main Authors: Prabagaran, S., Dhandapani, N. V., Potharaju, Raju, Hassan, Muntather M., Lalitha, Y. Sri
Format: Article
Language:English
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Summary:Significant advancements in the process of producing information and space have been made possible by the application of additive manufacturing (AM). Geometric patterns and unique designs. This study’s primary goal is to Section the impacts of temperatures ranging from room temperature to high temperature are reflected in the microstructure and attributes of items manufactured using Additive Manufacturing Technology. Microstructural examination can be done in a variety of ways, such as optical and scanning electron microscopy. Section: Grain sample evaluation using X-ray diffraction (XRD) and scanning electron microscopy (SEM) Phase composition and porosity. Measure mechanical attributes including hardness, fracture toughness, and tensile strength using accepted measurement methods. Temperature measurement techniques, such as Thermogravimetric Analysis (TGA) and Differential Scanning Calorimetry (DSC), are used to control temperature and change phase. This study investigates the effects of different printing parameters, including design direction, printing speed, and layer thickness. Characteristics and microstructure. Eliminating the gap between theory and practice is the goal of this study. Recognize and implement Section to encourage the application of additive manufacturing for companies that require increased performance in several areas, this is perfect.
ISSN:2267-1242
2267-1242
DOI:10.1051/e3sconf/202456411005