Increasing Heat Transfer from Metal Surfaces through Laser-Interference-Induced Microscopic Heat Sinks

With the increasing processing power of micro-electronic components and increasing spatial limitations, ensuring sufficient heat dissipation has become a crucial task. This work presents a microscopic approach to increasing the surface area through periodic surface structures. Microstructures with a...

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Bibliographic Details
Published in:Micromachines (Basel) 2023-09, Vol.14 (9), p.1730
Main Authors: Schell, Frederic, Chukwudi Okafor, Richard, Steege, Tobias, Alamri, Sabri, Ghevariya, Savan, Zwahr, Christoph, Lasagni, Andrés F.
Format: Article
Language:English
Subjects:
Aluminum
direct laser interference patterning
Dissipation
Electric potential
Electronic components
Electronic components industry
Embedded systems
Free convection
heat sink
Heat sinks
Heat transfer
Infrared lasers
Interference
Lasers
Metal surfaces
microstructures
nanosecond
Nanosecond pulses
Radiation
Stainless steel
Stainless steels
Steel plates
Surface area
Voltage
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Summary:With the increasing processing power of micro-electronic components and increasing spatial limitations, ensuring sufficient heat dissipation has become a crucial task. This work presents a microscopic approach to increasing the surface area through periodic surface structures. Microstructures with a periodic distance of 8.5 µm are fabricated via Direct Laser Interference Patterning (DLIP) on stainless steel plates with a nanosecond-pulsed infrared laser and are characterized by their developed interfacial area ratio. The optimal structuring parameters for increasing the surface area were investigated, reaching peak-to-valley depths up to 12.8 µm and increasing surface area by up to 394%. Heat dissipation in a natural convection environment was estimated by measuring the output voltage of a Peltier element mounted between a hot plate and a textured sample. The resulting increase in output voltage compared to an unstructured sample was correlated to the structure depth and developed interfacial area ratio, finding a maximum increase of 51.4%. Moreover, it was shown that the output voltage correlated well with the structure depth and surface area.
ISSN:2072-666X
2072-666X
DOI:10.3390/mi14091730