Gas-Solid Reaction Properties of Fluorine Compounds and Solid Adsorbents for Off-Gas Treatment from Semiconductor Facility

We have been developing a new dry-type off-gas treatment system for recycling fluorine from perfluoro compounds present in off-gases from the semiconductor industry. The feature of this system is to adsorb the fluorine compounds in the exhaust gases from the decomposition furnace by using two types...

Full description

Saved in:
Bibliographic Details
Published in:International Journal of Chemical Engineering 2012-01, Vol.2012 (2012), p.1-9
Main Authors: Yasui, Shinji, Shojo, Tadashi, Inoue, Goichi, Koike, Kunihiko, Takeuchi, Akihiro, Iwasa, Yoshio
Format: Article
Language:English
Subjects:
Adsorbents
Adsorption
Decomposition
Design engineering
Experiments
Fluorides
Fluorine
Fluorine compounds
Furnaces
Gas-solid reactions
Gases
Mathematical models
Perfluorocarbons
Recycling
Semiconductors
Water treatment
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:We have been developing a new dry-type off-gas treatment system for recycling fluorine from perfluoro compounds present in off-gases from the semiconductor industry. The feature of this system is to adsorb the fluorine compounds in the exhaust gases from the decomposition furnace by using two types of solid adsorbents: the calcium carbonate in the upper layer adsorbs HF and converts it to CaF2, and the sodium bicarbonate in the lower layer adsorbs HF and SiF4 and converts them to Na2SiF6. This paper describes the fluorine compound adsorption properties of both the solid adsorbents—calcium carbonate and the sodium compound—for the optimal design of the fixation furnace. An analysis of the gas-solid reaction rate was performed from the experimental results of the breakthrough curve by using a fixed-bed reaction model, and the reaction rate constants and adsorption capacity were obtained for achieving an optimal process design.
ISSN:1687-806X
1687-8078
DOI:10.1155/2012/329419