Built-In Packaging for Single Terminal Devices

An alternative packaging method, termed built-in packaging, is proposed for single terminal devices, and demonstrated with an actuator application. Built-in packaging removes the requirements of wire bonding, chip carrier, PCB, probe station, interconnection elements, and even wires to drive single...

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Bibliographic Details
Published in:Sensors (Basel, Switzerland) Switzerland), 2022-07, Vol.22 (14), p.5264
Main Authors: Gulsaran, Ahmet, Bastug Azer, Bersu, Kocer, Samed, Rahmanian, Sasan, Saritas, Resul, Abdel-Rahman, Eihab M., Yavuz, Mustafa
Format: Article
Language:English
Subjects:
actuator application
Actuators
Bonding
Chip carriers
Design
Lasers
MEMS
micro resonator
Optical measurement
Packaging
sensor application
Sensors
Wire
wire bonding
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Summary:An alternative packaging method, termed built-in packaging, is proposed for single terminal devices, and demonstrated with an actuator application. Built-in packaging removes the requirements of wire bonding, chip carrier, PCB, probe station, interconnection elements, and even wires to drive single terminal devices. Reducing these needs simplifies operation and eliminates possible noise sources. A micro resonator device is fabricated and built-in packaged for demonstration with electrostatic actuation and optical measurement. Identical actuation performances are achieved with the most conventional packaging method, wire bonding. The proposed method offers a compact and cheap packaging for industrial and academic applications.
ISSN:1424-8220
1424-8220
DOI:10.3390/s22145264