Development of Cold Plasma Technologies for Surface Decontamination of Seed Fungal Pathogens: Present Status and Perspectives

In view of the ever-growing human population and global environmental crisis, new technologies are emerging in all fields of our life. In the last two decades, the development of cold plasma (CP) technology has offered a promising and environmentally friendly solution for addressing global food secu...

Full description

Saved in:
Bibliographic Details
Published in:Journal of fungi (Basel) 2021-08, Vol.7 (8), p.650
Main Authors: Mravlje, Jure, Regvar, Marjana, Vogel-Mikuš, Katarina
Format: Article
Language:English
Subjects:
agriculture
Atoms & subatomic particles
Cold
cold plasma
Decontamination
Electric fields
Electrodes
Energy
Equilibrium
Food contamination & poisoning
Food security
Fungi
Fungicides
Gases
grains
microorganisms
Microwaves
Pathogens
Plasma
Radiation
Review
Seed germination
Seeds
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:In view of the ever-growing human population and global environmental crisis, new technologies are emerging in all fields of our life. In the last two decades, the development of cold plasma (CP) technology has offered a promising and environmentally friendly solution for addressing global food security problems. Besides many positive effects, such as promoting seed germination, plant growth, and development, CP can also serve as a surface sterilizing agent. It can be considered a method for decontamination of microorganisms on the seed surface alternative to the traditional use of fungicides. This review covers basics of CP technology and its application in seed decontamination. As this is a relatively young field of research, the data are scarce and hard to compare due to various plasma setups and parameters. On the other hand, the rapidly growing research field offers opportunities for novel findings and applications.
ISSN:2309-608X
2309-608X
DOI:10.3390/jof7080650