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Research on Geometric Constraint Strategies for Controlling the Diameter of Micro-Shafts Manufactured via Wire Electric Discharge Grinding

Micro-tools comprising difficult-to-machine materials have seen widespread application in micro-manufacturing to satisfy the demands of micro-part processing and micro-device development. Taking micro-shafts as an example, the related developmental technology, based on wire electric discharge grindi...

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Published in:Micromachines (Basel) 2023-11, Vol.14 (12), p.2178
Main Authors: Jia, Jianyu, Li, Zan, Hu, Bo, Wang, Yanqing, Wang, Jing, Li, Congbo, Xiang, Wenfeng
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container_issue 12
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container_title Micromachines (Basel)
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creator Jia, Jianyu
Li, Zan
Hu, Bo
Wang, Yanqing
Wang, Jing
Li, Congbo
Xiang, Wenfeng
description Micro-tools comprising difficult-to-machine materials have seen widespread application in micro-manufacturing to satisfy the demands of micro-part processing and micro-device development. Taking micro-shafts as an example, the related developmental technology, based on wire electric discharge grinding (WEDG) as the core method, is one of the key technologies used to prepare high-precision micro-shafts. To enable efficient and high-precision machining of micro-shafts with target diameters, instead of performing multiple repeated on-machine measurements and reprocessing, a geometric constraint strategy is proposed based on the previously introduced twin-mirroring-wire tangential feed electrical discharge grinding (TMTF-WEDG). This strategy encompasses the tool setting method, tangential feed distance compensation, and an equation that establishes the relationship between tangential distance and diameter variation. These components are derived from a key points analysis of the geometric constraints. The micro-shafts with diameters of 50 µm and consistencies of ±1.5 µm are repeatedly processed. A series of micro-shafts with diameters ranging from 30 µm to 120 µm achieve geometric constraints with a diameter accuracy of ±2 µm, accompanied by the complete continuous automation of the entire process. Accordingly, it can be concluded that the geometric constraint strategy is flexible and stable and can be controlled with high precision in the TMTF-WEDG process.
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subjects Accuracy
Analysis
Costs (Law)
diameter control
Diameters
Electric discharge grinding
Electrodes
Geometric accuracy
geometric constraint
Geometric constraints
Grinding
Grinding tools
Machining
micro EDM
micro-shaft
Microtools
Precision machining
Reprocessing
Tool setting
twin-mirroring-wire electrodes
WEDG
Wire
Wire industry
title Research on Geometric Constraint Strategies for Controlling the Diameter of Micro-Shafts Manufactured via Wire Electric Discharge Grinding
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