A New Low-Temperature Solder Assembly Technique to Replace Eutectic Sn-Bi Solder Assembly

We successfully achieved low-temperature assembly by reflowing the 13.5Sn-37.5Bi-45In-4Pb quaternary eutectic solder paste and the SAC 305 solder ball together at 140 °C for 5 min. The wetting angle of the mixed solder joint is 17.55°. The overall atomic percent of Pb in the mixed solder joint is le...

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Bibliographic Details
Published in:Micromachines (Basel) 2022-05, Vol.13 (6), p.867
Main Authors: Sun, Lingyao, Guo, Zhenhua, Zhao, Xiuchen, Liu, Ying, Tu, Kingning, Liu, Yingxia
Format: Article
Language:English
Subjects:
3D IC
Aging
Alloys
Assembly
Bi aggregation
Bismuth
Brittleness
Composition
Eutectics
Integrated circuit fabrication
Low temperature
low-temperature soldering
Mechanical properties
Methods
Packaging industry
Shear strength
Shear tests
Sn-Bi solder
Solder and soldering
Soldered joints
Solders
Tin compounds
Wetting
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Summary:We successfully achieved low-temperature assembly by reflowing the 13.5Sn-37.5Bi-45In-4Pb quaternary eutectic solder paste and the SAC 305 solder ball together at 140 °C for 5 min. The wetting angle of the mixed solder joint is 17.55°. The overall atomic percent of Pb in the mixed solder joint is less than 1%, which can be further reduced or eliminated. Moreover, after aging at 80 °C for 25 days, we observed no obvious decrease in shear strength of the fully mixed solder joint, which is the most advantage of this assembly technique over Sn58Bi solder assembly. The Bi phase segregation at the interface is slowed down compared with Sn-Bi solder joint. This low-temperature assembly is promising to be applied in advanced packaging technology to replace the eutectic Sn-Bi solder.
ISSN:2072-666X
2072-666X
DOI:10.3390/mi13060867