Balancing the Efficiency and Sensitivity of Defect Inspection of Non-Patterned Wafers with TDI-Based Dark-Field Scattering Microscopy

In semiconductor manufacturing, defect inspection in non-patterned wafer production lines is essential to ensure high-quality integrated circuits. However, in actual production lines, achieving both high efficiency and high sensitivity at the same time is a significant challenge due to their mutual...

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Bibliographic Details
Published in:Sensors (Basel, Switzerland) Switzerland), 2024-03, Vol.24 (5), p.1622
Main Authors: Yu, Fei, Xu, Min, Wang, Junhua, Zhang, Xiangchao, Tang, Xinlan
Format: Article
Language:English
Subjects:
dark-field microscopy
Defects
Efficiency
Electronics industry
Integrated circuit fabrication
Lasers
Light
Microscope and microscopy
non-patterned wafer inspection
optical inspection
Power
Scanning electron microscopy
Sensors
time delay integration
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Summary:In semiconductor manufacturing, defect inspection in non-patterned wafer production lines is essential to ensure high-quality integrated circuits. However, in actual production lines, achieving both high efficiency and high sensitivity at the same time is a significant challenge due to their mutual constraints. To achieve a reasonable trade-off between detection efficiency and sensitivity, this paper integrates the time delay integration (TDI) technology into dark-field microscopy. The TDI image sensor is utilized instead of a photomultiplier tube to realize multi-point simultaneous scanning. Experiments illustrate that the increase in the number of TDI stages and reduction in the column fixed pattern noise effectively improve the signal-to-noise ratio of particle defects without sacrificing the detecting efficiency.
ISSN:1424-8220
1424-8220
DOI:10.3390/s24051622