Structural and Morphological Studies of Pt in the As-Grown and Encapsulated States and Dependency on Film Thickness

• Published in: Nanomaterials (Basel, Switzerland) Switzerland), 2024-04, Vol.14 (8), p.725
• Main Authors: Nergis, Berkin, Bauer, Sondes, Jin, Xiaowei, Horak, Lukas, Schneider, Reinhard, Holy, Vaclav, Seemann, Klaus, Ulrich, Sven, Baumbach, Tilo
• Format: Article
• Language: English
• Subjects: Annealing; bottom electrode; Capping; Crystal structure; Crystals; dewetting; Dielectric films; Drying; Electrodes; encapsulated platinum; Encapsulation; Ferroelectricity; Film thickness; Grain boundaries; Heterostructures; High temperature; hillock formation; Lasers; Mechanical properties; Metals; Microelectromechanical systems; Morphology; Platinum; PLD; Pulsed laser deposition; Pulsed lasers; Scanning electron microscopy; Spectrum analysis; Structure; Temperature; Thermal stability; Thin films; Topography; Transmission electron microscopy; Yttria-stabilized zirconia; Yttrium oxide; Zirconia
• ISSN: 2079-4991; 2079-4991
• DOI: 10.3390/nano14080725

The morphology and crystal structure of Pt films grown by pulsed laser deposition (PLD) on yttria-stabilized zirconia (YSZ)at high temperatures = 900 °C was studied for four different film thicknesses varying between 10 and 70 nm. During the subsequent growth of the capping layer, the thermal stability of the Pt was strongly influenced by the Pt film's thickness. Furthermore, these later affected the film morphology, the crystal structure and hillocks size, and distribution during subsequent growth at = 900 °C for a long duration. The modifications in the morphology as well as in the structure of the Pt film without a capping layer, named also as the as-grown and encapsulated layers in the bilayer system, were examined by a combination of microscopic and scattering methods. The increase in the thickness of the deposited Pt film brought three competitive phenomena into occurrence, such as 3D-2D morphological transition, dewetting, and hillock formation. The degree of coverage, film continuity, and the crystal quality of the Pt film were significantly improved by increasing the deposition time. An optimum Pt film thickness of 70 nm was found to be suitable for obtaining a hillock-free Pt bottom electrode which also withstood the dewetting phenomena revealed during the subsequent growth of capping layers. This achievement is crucial for the deposition of functional bottom electrodes in ferroelectric and multiferroic heterostructure systems.