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Self-Limited Low-Temperature Trimming and Fully Silicided S/D for Vertically Stacked Cantilever Gate-All-Around Poly-Si Junctionless Nanosheet Transistors
A self-limited low-temperature trimming process is demonstrated without surface morphology degradation. It shows great potential to control the trimming process with a large process window (400-900 s). Subthreshold characteristics are improved and I off is drastically reduced (~two orders of magnitu...
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Published in: | IEEE journal of the Electron Devices Society 2019, Vol.7, p.959-963 |
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description | A self-limited low-temperature trimming process is demonstrated without surface morphology degradation. It shows great potential to control the trimming process with a large process window (400-900 s). Subthreshold characteristics are improved and I off is drastically reduced (~two orders of magnitude) with increasing trimming cycles. Full silicidation on the source/drain (FUSI-S/D) is performed to improve I on . Surprisingly, after silicidation, both I on and μ FE shows degradation despite that the series resistance is improved. An ultrathin body junctionless (UTB-JL) device is fabricated to investigate the degradation cause by direct CV measurement on the device, which can give us an insight into the details of the change with the silicidation. |
doi_str_mv | 10.1109/JEDS.2019.2940606 |
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(IEEE) 2019</rights><lds50>peer_reviewed</lds50><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c402t-93f894ee751cd34e681accbd5a9bb02c6569d1f8de7f6f26f98d20b22923becd3</citedby><cites>FETCH-LOGICAL-c402t-93f894ee751cd34e681accbd5a9bb02c6569d1f8de7f6f26f98d20b22923becd3</cites><orcidid>0000-0003-3395-4022 ; 0000-0001-9618-207X</orcidid></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/8843925$$EHTML$$P50$$Gieee$$Hfree_for_read</linktohtml><link.rule.ids>314,780,784,4024,27633,27923,27924,27925,54933</link.rule.ids></links><search><creatorcontrib>Chung, Chris Chun-Chih</creatorcontrib><creatorcontrib>Ko, Chun-Ming</creatorcontrib><creatorcontrib>Chao, Tien-Sheng</creatorcontrib><title>Self-Limited Low-Temperature Trimming and Fully Silicided S/D for Vertically Stacked Cantilever Gate-All-Around Poly-Si Junctionless Nanosheet Transistors</title><title>IEEE journal of the Electron Devices Society</title><addtitle>JEDS</addtitle><description>A self-limited low-temperature trimming process is demonstrated without surface morphology degradation. It shows great potential to control the trimming process with a large process window (400-900 s). Subthreshold characteristics are improved and I off is drastically reduced (~two orders of magnitude) with increasing trimming cycles. Full silicidation on the source/drain (FUSI-S/D) is performed to improve I on . Surprisingly, after silicidation, both I on and μ FE shows degradation despite that the series resistance is improved. An ultrathin body junctionless (UTB-JL) device is fabricated to investigate the degradation cause by direct CV measurement on the device, which can give us an insight into the details of the change with the silicidation.</description><subject>Chemicals</subject><subject>Degradation</subject><subject>fully silicided-S/D</subject><subject>Ions</subject><subject>junctionless</subject><subject>Logic gates</subject><subject>Low temperature</subject><subject>low-temperature trimming</subject><subject>monolithic 3D-ICs</subject><subject>Morphology</subject><subject>nanosheet</subject><subject>Nanosheets</subject><subject>poly-Si</subject><subject>Self-Limit</subject><subject>Silicidation</subject><subject>Silicides</subject><subject>Silicon</subject><subject>Surface morphology</subject><subject>Surface treatment</subject><subject>Transistors</subject><subject>Trimming</subject><subject>vertically stacked</subject><issn>2168-6734</issn><issn>2168-6734</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2019</creationdate><recordtype>article</recordtype><sourceid>ESBDL</sourceid><sourceid>DOA</sourceid><recordid>eNpNUc1uGyEQXlWt1CjJA1S9IPW8DrC7LBwt56eJrLbSur0iFoYUFy8usK38Kn3a4DiKOhdGM98Po6-qPhC8IASLq4eb62FBMRELKlrMMHtTnVHCeM36pn37X_--ukxpi0txwgRjZ9W_Abyt127nMhi0Dn_rDez2EFWeI6BNdLudmx6Rmgy6nb0_oMF5p50p4OHqGtkQ0Q-I2Wn1vMxK_yqrlZqy8_AHIrpTGeql9_UyhrmofAv-UA8OPcyTzi5MHlJCX9QU0k-AXBzVlFzKIaaL6p1VPsHly3tefb-92aw-1-uvd_er5brWLaa5Fo3logXoO6JN0wLjRGk9mk6JccRUs44JQyw30FtmKbOCG4pHSgVtRiiU8-r-pGuC2sp9OVnFgwzKyedBiI9SHS_0IIEJzSkBzDVtrWDcqlFjjXHfY9vwrmh9OmntY_g9Q8pyG-Y4le_LYlgcOW_6giInlI4hpQj21ZVgeUxUHhOVx0TlS6KF8_HEcQDwiue8bQTtmifJ9J56</recordid><startdate>2019</startdate><enddate>2019</enddate><creator>Chung, Chris Chun-Chih</creator><creator>Ko, Chun-Ming</creator><creator>Chao, Tien-Sheng</creator><general>IEEE</general><general>The Institute of Electrical and Electronics Engineers, Inc. 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It shows great potential to control the trimming process with a large process window (400-900 s). Subthreshold characteristics are improved and I off is drastically reduced (~two orders of magnitude) with increasing trimming cycles. Full silicidation on the source/drain (FUSI-S/D) is performed to improve I on . Surprisingly, after silicidation, both I on and μ FE shows degradation despite that the series resistance is improved. An ultrathin body junctionless (UTB-JL) device is fabricated to investigate the degradation cause by direct CV measurement on the device, which can give us an insight into the details of the change with the silicidation.</abstract><cop>New York</cop><pub>IEEE</pub><doi>10.1109/JEDS.2019.2940606</doi><tpages>5</tpages><orcidid>https://orcid.org/0000-0003-3395-4022</orcidid><orcidid>https://orcid.org/0000-0001-9618-207X</orcidid><oa>free_for_read</oa></addata></record> |
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subjects | Chemicals Degradation fully silicided-S/D Ions junctionless Logic gates Low temperature low-temperature trimming monolithic 3D-ICs Morphology nanosheet Nanosheets poly-Si Self-Limit Silicidation Silicides Silicon Surface morphology Surface treatment Transistors Trimming vertically stacked |
title | Self-Limited Low-Temperature Trimming and Fully Silicided S/D for Vertically Stacked Cantilever Gate-All-Around Poly-Si Junctionless Nanosheet Transistors |
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