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Self-Limited Low-Temperature Trimming and Fully Silicided S/D for Vertically Stacked Cantilever Gate-All-Around Poly-Si Junctionless Nanosheet Transistors

A self-limited low-temperature trimming process is demonstrated without surface morphology degradation. It shows great potential to control the trimming process with a large process window (400-900 s). Subthreshold characteristics are improved and I off is drastically reduced (~two orders of magnitu...

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Published in:IEEE journal of the Electron Devices Society 2019, Vol.7, p.959-963
Main Authors: Chung, Chris Chun-Chih, Ko, Chun-Ming, Chao, Tien-Sheng
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Language:English
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description A self-limited low-temperature trimming process is demonstrated without surface morphology degradation. It shows great potential to control the trimming process with a large process window (400-900 s). Subthreshold characteristics are improved and I off is drastically reduced (~two orders of magnitude) with increasing trimming cycles. Full silicidation on the source/drain (FUSI-S/D) is performed to improve I on . Surprisingly, after silicidation, both I on and μ FE shows degradation despite that the series resistance is improved. An ultrathin body junctionless (UTB-JL) device is fabricated to investigate the degradation cause by direct CV measurement on the device, which can give us an insight into the details of the change with the silicidation.
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source IEEE Open Access Journals
subjects Chemicals
Degradation
fully silicided-S/D
Ions
junctionless
Logic gates
Low temperature
low-temperature trimming
monolithic 3D-ICs
Morphology
nanosheet
Nanosheets
poly-Si
Self-Limit
Silicidation
Silicides
Silicon
Surface morphology
Surface treatment
Transistors
Trimming
vertically stacked
title Self-Limited Low-Temperature Trimming and Fully Silicided S/D for Vertically Stacked Cantilever Gate-All-Around Poly-Si Junctionless Nanosheet Transistors
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