Ultrasonic-assisted electrodeposition of Cu-Sn-TiO2 nanocomposite coatings with enhanced antibacterial activity

• Published in: Ultrasonics sonochemistry 2021-07, Vol.75, p.105593, Article 105593
• Main Authors: Kharitonov, Dmitry S., Kasach, Aliaksandr A., Sergievich, Denis S., Wrzesińska, Angelika, Bobowska, Izabela, Darowicki, Kazimierz, Zielinski, Artur, Ryl, Jacek, Kurilo, Irina I.
• Format: Article
• Language: English
• Subjects: Antibacterial properties; Cu–Sn–TiO2; Electrochemical properties; Nanocomposite coating; Original; Ultrasonic-assisted electrodeposition
• ISSN: 1350-4177; 1873-2828
• DOI: 10.1016/j.ultsonch.2021.105593

•Cu–Sn–TiO2 nanocomposite coatings were electrodeposited under mechanical and ultrasonic agitation;•Effect of TiO2 nanoparticles and current density on structural and antibacterial properties was investigated.•Distribution of TiO2 in the coatings improved under ultrasonic agitation;•Antibacterial activity of Cu–Sn–TiO2 coatings was enhanced by ultrasonic agitation. Copper-based coatings are known for their high antibacterial activity. In this study, nanocomposite Cu–Sn–TiO2 coatings were obtained by electrodeposition from an oxalic acid bath additionally containing 4 g/dm3 TiO2 with mechanical and ultrasonic agitation. Ultrasound treatment was performed at 26 kHz frequency and 32 W/dm3 power. The influence of agitation mode and the current load on the inclusion and distribution of the TiO2 phase in the Cu–Sn metallic matrix were evaluated. Results indicated that ultrasonic agitation decreases agglomeration of TiO2 particles and allows for the deposition of dense Cu–Sn–TiO2 nanocomposites. It is shown that nanocomposite Cu–Sn–TiO2 coatings formed by ultrasonic-assisted electrodeposition exhibit excellent antimicrobial properties against E. coli bacteria.