Nanoscale Phase Change Material Array by Sub-Resolution Assist Feature for Storage Class Memory Application

• Published in: Nanomaterials (Basel, Switzerland) Switzerland), 2023-03, Vol.13 (6), p.1050
• Main Authors: Zhang, Jiarui, Fang, Wencheng, Wang, Ruobing, Li, Chengxing, Zheng, Jia, Zou, Xixi, Song, Sannian, Song, Zhitang, Zhou, Xilin
• Format: Article
• Language: English
• Subjects: Alternation learning; Arrays; Carbon; Chemical vapor deposition; Computer storage devices; Design; Design and construction; Edgelines; Energy; Engineering research; Etching; High density; Ion beams; Light; Lithography; Materials; micro-loading effect; Microscopy; Nanotechnology; optical proximity effect; Optimization; Patterning; Phase change materials; phase change memory; Plasma etching; Proximity effect (electricity); Random access memory; Silicon wafers; SRAF; storage class memory
• ISSN: 2079-4991; 2079-4991
• DOI: 10.3390/nano13061050

High density phase change memory array requires both minimized critical dimension (CD) and maximized process window for the phase change material layer. High in-wafer uniformity of the nanoscale patterning of chalcogenides material is challenging given the optical proximity effect (OPE) in the lithography process and the micro-loading effect in the etching process. In this study, we demonstrate an approach to fabricate high density phase change material arrays with half-pitch down to around 70 nm by the co-optimization of lithography and plasma etching process. The focused-energy matrix was performed to improve the pattern process window of phase change material on a 12-inch wafer. A variety of patternings from an isolated line to a dense pitch line were investigated using immersion lithography system. The collapse of the edge line is observed due to the OPE induced shrinkage in linewidth, which is deteriorative as the patterning density increases. The sub-resolution assist feature (SRAF) was placed to increase the width of the lines at both edges of each patterning by taking advantage of the optical interference between the main features and the assistant features. The survival of the line at the edges is confirmed with around a 70 nm half-pitch feature in various arrays. A uniform etching profile across the pitch line pattern of phase change material was demonstrated in which the micro-loading effect and the plasma etching damage were significantly suppressed by co-optimizing the etching parameters. The results pave the way to achieve high density device arrays with improved uniformity and reliability for mass storage applications.