Performance enhancement of building energy through the combination of dynamic insulation panels and phase changing materials

• Published in: Energy reports 2022-11, Vol.8, p.945-958
• Main Authors: Gopalan, Anitha, Antony, A. Santhi Mary, Suresh, R., Sahoo, Satyajeet, Livingston, L.M. Merlin, Titus, Anita, Nanammal, V., Mohanavel, V., Sathyamurthy, Ravishankar
• Format: Article
• Language: English
• Subjects: Buildings; Dynamic insulation panels; Energy; Optimization; Phase changing materials
• ISSN: 2352-4847; 2352-4847
• DOI: 10.1016/j.egyr.2022.10.281

The use of phase change materials (PCM), a type of heat transfer thermal storage substance, shows the opportunity to enhance the thermal inertia of these structures lacking significantly altering present construction methods. Because of the decreased indoor temperature swings and the load reduction, the usage of PCMs in buildings has the potential to deliver higher indoor temperatures for inhabitants as well as weaker export power consumption. Thermal energy storage (TES) systems based on phase change material (PCM) is identified as among the most enhanced energy techniques to improve eco-efficiency and conservation. The proposed dynamic insulating material and system (DIMS) allows for thermal resistance to be adjusted based on interior and outside variables. While it can be shown that using PCM and DIMS in facades enhances energy efficiency, there have been no previous studies that looked at the combined effect of the two technologies. Explore a unique wall design that includes a sheet of PCM made up of two levels of DIMS in this research. In most of the seasons and building orientations studied in this research, the PCM-DIMS-integrated wall saves much more energy than the DIMS-only combined barrier or the PCM-only combined walls. The PCM-DIMS-integrated walls can give a 15% to 72% decrease in yearly radiant heat then a 7% to 38% reduction in annual heat loss, based on the environment. The findings of this study highlight the necessity for scaled dynamic insulating layers for structures, as well as thermal storage devices.