Development of Steps in an Automated Process Chain for Piezoceramic-Metal Compound Production

The potential of adaptronic applications has been proven in many conceptual studies. A broad use in high-efficiency branches is often hindered by the absence of an appropriate assembly method. Especially for piezoceramic foil transducers, the application on structural parts can be simplified using a...

Full description

Saved in:
Bibliographic Details
Published in:Journal of Manufacturing and Materials Processing 2019-03, Vol.3 (1), p.3
Main Authors: Drossel, Welf-Guntram, Nestler, Matthias, Hensel, Sebastian
Format: Article
Language:English
Subjects:
Actuators
Adhesives
Aluminum
Approximation
Automation
Automobiles
compound
Condition monitoring
Curing
Electric fields
Electric heating elements
Electric vehicles
Electrodes
Energy harvesting
failure
Foils
Investigations
Metal compounds
Noise generation
Noise reduction
piezoceramic
Piezoelectricity
Process management
Process parameters
Process planning
Rheology
rotational rheometer
sandwich
Sensors
Shape control
Shear strength
Smart materials
Strain hardening
Structural health monitoring
Tension tests
Transducers
Citations: Items that this one cites
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:The potential of adaptronic applications has been proven in many conceptual studies. A broad use in high-efficiency branches is often hindered by the absence of an appropriate assembly method. Especially for piezoceramic foil transducers, the application on structural parts can be simplified using a semi-finished part that includes the transducer. The part is then shaped in a final forming operation. The purpose of the present study is the investigation of process limits in automated process chains for producing semi-finished parts. An adhesive is used in the process, which is only locally cured. This bi-conditioned state is achieved using cooling and heating elements. The process limits are mainly affected by the choice of temperature and curing time between adhesive application and forming operation. Several tests with a rotational rheometer were carried out to investigate the curing behavior. An appropriate process window was identified varying processing time and temperature. The results were then used to build a model of the curing behavior. A mathematical approach had to be used to find the best configuration because no sharp border exists between the two adhesive conditions of liquid and solid state. The process parameters were proven with runs inside and outside of the process limits.
ISSN:2504-4494
2504-4494
DOI:10.3390/jmmp3010003