Analysis of Dynamic Plastic Deformation process on an Electrolytic Tough - Pitch copper (Cu-ETP): From material characterization to models improvement

• Main Authors: Mespoulet, Jérôme, Beucia, Bermane, Tingaud, David, Hereil, Pierre-Louis, Couque, Hervé, Dirras, Guy
• Format: Conference Proceeding
• Language: English
• Subjects: Computer simulation; Copper; Crystallography; Deceleration; Dynamic loads; Empirical analysis; Grain size; Mathematical models; Numerical analysis; Plastic deformation; Projectiles; Strain rate; Tensile tests
• ISSN: 2100-014X; 2101-6275; 2100-014X
• DOI: 10.1051/epjconf/201818303023

This paper presents a comprehensive study of a direct impact compression loading on an Electrolytic Tough-Pitch copper (Cu-ETP). The aim of the study is to provide reliable experimental data in this dynamic loading using high-speed video camera records and real time projectile deceleration profiles. Test set-up has been optimized to ensure an efficient recovery of the samples after the Dynamic Plastic Deformation (DPD) process in the 10 3 to 10 4 s -1 strain rate range regime. Structural investigations have been made on post-mortem samples: microstructure investigations of recovered samples have shown more structural changes in terms of crystallographic texture and grain sizes. Post-mortem tensile tests have also been carried out to evaluate yield strength behavior of the Cu-ETP copper after the DPD process. Numerical simulations have been performed to evaluate the ability of empirical models to reproduce recorded signals. In-situ results (time evolution of strain, strain rate, temperature, etc.) given by the numerical analysis have contributed to enrich the post-mortem analysis.