Novel Abrasive-Impregnated Pads and Diamond Plates for the Grinding and Lapping of Single-Crystal Silicon Carbide Wafers

In this study, special ceramic grinding plates impregnated with diamond grit and other abrasives, as well as self-made lapping plates, were used to prepare the surface of single-crystal silicon carbide (SiC) wafers. This novel approach enhanced the process and reduced the final chemical mechanical p...

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Bibliographic Details
Published in:Applied sciences 2021-02, Vol.11 (4), p.1783
Main Authors: Tsai, Ming-Yi, Li, Kun-Ying, Ji, Sun-Yu
Format: Article
Language:English
Subjects:
Abrasive wear
Abrasives
Aluminum
Aluminum oxide
Ceramics
Chemical-mechanical polishing
diamond grit
Diamond polishing
Diamonds
Efficiency
Grinding
Investigations
Lapping (finishing)
Material removal rate (machining)
Metal plates
polishing plate
resin pads
Silicon
Silicon carbide
Silicon dioxide
Silicon substrates
Silicon wafers
Single crystals
single-crystal silicon carbide
Substrates
Surface finish
Surface properties
Surface roughness
Wafers
Wear rate
Wheels
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Summary:In this study, special ceramic grinding plates impregnated with diamond grit and other abrasives, as well as self-made lapping plates, were used to prepare the surface of single-crystal silicon carbide (SiC) wafers. This novel approach enhanced the process and reduced the final chemical mechanical planarization (CMP) polishing time. Two different grinding plates with pads impregnated with mixed abrasives were prepared: one with self-modified diamond + SiC and a ceramic binder and one with self-modified diamond + SiO2 + Al2O3 + SiC and a ceramic binder. The surface properties and removal rate of the SiC substrate were investigated and a comparison with the traditional method was conducted. The experimental results showed that the material removal rate (MRR) was higher for the SiC substrate with the mixed abrasive lapping plate than for the traditional method. The grinding wear rate could be reduced by 31.6%. The surface roughness of the samples polished using the diamond-impregnated lapping plate was markedly better than that of the samples polished using the copper plate. However, while the surface finish was better and the grinding efficiency was high, the wear rate of the mixed abrasive-impregnated polishing plates was high. This was a clear indication that this novel method was effective and could be used for SiC grinding and lapping.
ISSN:2076-3417
2076-3417
DOI:10.3390/app11041783