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Evaluation of thermal conductivity models and dielectric properties in metal oxide-filled poly(butylene succinate-co-adipate) composites

This study examines how various nanofillers impact thermal conductivity, dielectric characteristics, and electromagnetic interference (EMI) shielding potential of bio-based and biodegradable poly(butylene succinate-co-adipate) (PBSA). TiO 2 , NiFe 2 O 4 , Fe 2 O 3 , and Fe 3 O 4 were selected as fil...

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Bibliographic Details
Published in:Scientific reports 2024-06, Vol.14 (1), p.13629-18
Main Authors: Bleija, Miks, Platnieks, Oskars, Starkova, Olesja, Macutkevič, Jan, Tsyhanok, Dzmitry, Orlova, Liga, Gaidukovs, Sergejs
Format: Article
Language:English
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Summary:This study examines how various nanofillers impact thermal conductivity, dielectric characteristics, and electromagnetic interference (EMI) shielding potential of bio-based and biodegradable poly(butylene succinate-co-adipate) (PBSA). TiO 2 , NiFe 2 O 4 , Fe 2 O 3 , and Fe 3 O 4 were selected as fillers for nanocomposites at 4–50 vol.% (12–81 wt.%). The nanocomposites were analyzed in three domains: structural (scanning electron microscopy, energy dispersive X-ray spectroscopy mapping, density, tensile testing), thermal (light flash analysis, literature models), and dielectric (AC conductivity, permittivity, EM shielding effectiveness (SE)). The investigated fillers showed good dispersion and compatibility with the PBSA matrix. LFA was analyzed according to literature models, where Bruggeman and Agari models showed the best fit at high concentrations. The dielectric analysis revealed that most of the nanocomposites did not reach percolation; thus, producing thermally conductive plastics that are electrically insulating. EMI shielding was limited to frequencies below 10 Hz, with the notable exception of Fe 3 O 4 (100 nm and loading of > 25 vol.%), which showed shielding at frequencies up to 10 5  Hz. The investigated composites based on a biodegradable polyester and abundant metal oxide nanofillers are suitable for the production of cheap, ecological, and electrically insulating heat dissipation solutions required for modern and lightweight applications.
ISSN:2045-2322
2045-2322
DOI:10.1038/s41598-024-64426-5